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4 layer HDI blind buried flex-rigid pcb for communication electronic devices
4 layer HDI blind buried flex-rigid pcb for communication electronic devices
HDI second-order 8 layer – HDI PCB – buried blind hole flex-rigid pcb
HDI second-order 8 layer – HDI PCB – buried blind hole flex-rigid pcb
4 layer HDI blind buried flex-rigid pcb for communication electronic devices
4 layer HDI blind buried flex-rigid pcb for communication electronic devices
Multi-Layer HDI PCB Circuit Boards Quick Turn Pcb Manufacturers
Multi-Layer HDI PCB Circuit Boards Quick Turn Pcb Manufacturers
HDI second-order 8 layer – HDI PCB – buried blind hole flex-rigid pcb
HDI second-order 8 layer – HDI PCB – buried blind hole flex-rigid pcb
6 Layer HDI PCB FR4 Circuit Boards Pcb Gold Fingers
6 Layer HDI PCB FR4 Circuit Boards Pcb Gold Fingers
4 layer HDI blind buried flex-rigid pcb for communication electronic devices
4 layer HDI blind buried flex-rigid pcb for communication electronic devices 

Product Type: 4 layer HDI Flex-Rigid PCB
Applications: Communication electronic equipment
Material: PI,Copper,adhesive，FR4
Line width and line spacing：0.1mm/0.1mm

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Multi-Layer HDI PCB Circuit Boards Quick Turn Pcb Manufacturers
Multi-Layer HDI PCB Circuit Boards Quick Turn Pcb Manufacturers 

PCB: HDI
Product application: Aviation
Board Layers: 4 layer
Base material: FR4

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HDI second-order 8 layer – HDI PCB – buried blind hole flex-rigid pcb
HDI second-order 8 layer – HDI PCB – buried blind hole flex-rigid pcb 

Product Type: 8 layer HDI Second-Order Flex-Rigid PCB
Applications: Automotive
Material: PI,Copper,adhesive,FR4
Line width and line spacing：0.1mm/0.1mm

InquiryDetail

6 Layer HDI PCB FR4 Circuit Boards Pcb Gold Fingers
6 Layer HDI PCB FR4 Circuit Boards Pcb Gold Fingers 

Product application: Automotive
Board Layers: 6 layer
Base material: FR4
Inner Cu thickness: 18

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Capel manufacturing PCBs since 2009. Professional technology and high-precision Printed Circuit Boards involved in Medical, IOT, UAV, Aviation, Automotive, Aerospace, Industrial Control, Artificial Intelligence, Consumer Electronics etc..

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