Material & Structure: "Flexible Substrate" vs "Rigid Base"

• Flexible Printed Circuit (FPC): Core is a "flexible substrate" (Polyimide/PI or Polyethylene Terephthalate/PET) without a rigid support layer. Copper foil is tightly bonded to the substrate via special adhesive, enabling bending or folding at any angle. Essentially a "deformable circuit carrier."
• Traditional PCB: Core is a "rigid substrate" (Flame Retardant Grade 4/FR-4), a rigid board formed by curing glass fiber and epoxy resin. Copper foil is attached to the board surface and cannot withstand bending forces. Essentially a "fixed-shape circuit platform."

Core Characteristics: "Adapting to Complex Scenarios" vs "Ensuring Stable Performance"

• Key Advantages of FPC: Addresses "space constraints" and "dynamic requirements" — e.g., signal transmission in the hinge area of foldable phones (needing repeated bending) and circuits in smartwatch straps (needing to fit curved surfaces), which traditional PCBs cannot achieve.

• Key Advantages of Traditional PCB: Addresses "stable load-bearing" and "high-power demands" — e.g., industrial control motherboards (needing to withstand equipment vibration and high current-carrying capacity) and server motherboards (needing complex wiring and long-term static stability). In these scenarios, FPC is at a clear disadvantage in terms of cost and current-carrying capacity.
  

Manufacturing Process & Cost: "Precision Customization" vs "Mass-Produced General Purpose"

• FPC Manufacturing Process: Relies on laser cutting (ensuring irregular shape precision), flexible lamination (avoiding interlayer separation), and precision etching (adapting to microcircuits). High process threshold, suitable for small-batch, customized orders.
• Traditional PCB Manufacturing Process: Mature processes such as mechanical drilling and wave soldering enable mass-produced standardized production with high yield rate (≥98%), suitable for general-purpose, high-volume products.

Application Scenarios: "Thin, Lightweight & Flexible" vs "General-Purpose & High-Power"

• Irreplaceability of FPC: FPC is the only choice if the product requires "miniaturization, thinness, lightweight, or flexibility" — e.g., implantable medical devices (needing to fit human tissues) and new energy vehicle battery packs (needing to adapt to battery shapes).
• Dominant Scenarios of Traditional PCB: Most electronic devices that do not require deformation, especially high-power products with complex wiring — e.g., home appliance motherboards (cost-sensitive), industrial power supply boards (high current-carrying demands), and server motherboards (complex wiring).