Part 1: Who We Are & What We Can Do

Let's talk about Shenzhen Caboer Technology Co., Ltd. We've been in the specialized PCB and FPC manufacturing game for over 16 years. We're not just another board house; we're a tech-focused company with a complete in-house capability to design and build the complex, high-performance PCBs that modern industrial control systems demand.

Here’s a quick look at our core technical strengths:

• Advanced HDI Manufacturing: We produce sophisticated HDI boards ranging from 2 to 30 layers. We handle 1 to 5-step laser microvias (blind and buried vias), with mind-bendingly small features like a 0.08mm minimum hole size and trace/space down to 2mil/2mil. This is all about packing more functionality into tighter spaces.

• High-Frequency & High-Speed Expertise: This is our sweet spot. We've mastered the use of low-loss materials and have tight control over impedance, making our boards perfect for signals racing above 10GHz. Your data gets where it needs to go, fast and clean.

• Built for Tough Industrial Duty: Our products aren't for a cozy office. They're engineered to perform reliably in the harsh realities of industrial environments. We're talking extreme temperatures from -40°C to 125°C, and under constant vibration (10-2000Hz/5g). They just work, day in and day out.

Part 2: Our Product Specs & Killer Features

1. Material Systems: Designed for Harsh Environments

We don't use one-size-fits-all materials. We pick the right material for the job, ensuring performance and reliability.

Our Smart Mix: A real game-changer is our "Hybrid" structure. We use expensive high-frequency materials only where the signals absolutely need it, and pair them with robust, cost-effective High Tg FR4 for the rest of the board. This gives you the performance you need at a price that makes sense for cost-sensitive industrial applications.

2. Structure & Design: High Density Meets Signal Integrity

• Microvias & Stack-up Mastery:

  • We use UV laser drilling for super-precise holes (±5µm accuracy) and smooth walls (Ra≤1.0µm). Smoother walls mean less signal reflection.

  • Our clever use of blind and buried vias (e.g., in a 1+4+1 stack-up) shortens the signal path, cutting down high-frequency signal loss by 15-20%.

  • We design symmetrical stack-ups (e.g., 8-layer: 2 Signal + 2 Power + 2 Ground + 2 Signal) to control thermal expansion (CTE=12-16ppm/°C). This prevents warping and cracking as the board heats up and cools down repeatedly.

• Guaranteeing Signal Integrity:

  • We nail differential pair impedance (50Ω/100Ω) with a tight ±3% tolerance. This is critical for modern industrial protocols like Industrial Ethernet and PCIe.

  • We can embed shielding structures right into the board to suppress EMI noise, helping you easily meet tough industrial EMC standards.

3. Manufacturing & Process: Precision for Reliability

It's not just about design; it's about how we build it. Our processes are fine-tuned for maximum reliability.

Part 3: Where They Shine & The Value They Bring

1. Industrial Automation Control Systems

• The Applications:

  • PLC Main Boards: Our high-density designs can integrate 700+ I/O points, supporting PROFINET, Modbus, and more, with lightning-fast response times under 1ms.

  • Industrial Robot Control Boards: These boards handle powerful ARM Cortex-M7 processors (300MHz+), processing over 2000 parallel instructions for precise, coordinated motion control.

  • Distributed I/O Modules: We use embedded passive components (resistors/capacitors) to cut down part count by 30%, which also boosts vibration resistance for harsh factory floors.

• The Bottom Line for You: You get a 50% boost in system reliability, a Mean Time Between Failures (MTBF) of 10 years or more, and maintenance costs slashed by 40%.

2. Energy & Power Equipment Control

• Where You'll Use Them:

  • VFD Control Boards: High Tg materials (≥180°C) stand up to the heat from power components. Our multi-layer designs provide perfect isolation between high-power and low-power signals, keeping the control logic clean and stable.

  • Solar Inverter Main Boards: Our low-loss, high-frequency designs (e.g., ≤0.2dB/in loss at 28GHz) help optimize MPPT algorithms, boosting power conversion efficiency by up to 18%.

  • Smart Grid Terminals: They integrate CAN bus and RS485 interfaces, operating flawlessly from -40°C to 85°C, with super-low data latency under 5µs.

3. Industrial Vision & Inspection Systems

• Why Our Boards Excel Here:

  • High-Speed Data: With 10Gbps automotive-grade Ethernet interfaces and precisely controlled impedance (100Ω±5%), we guarantee your image data gets transferred without a glitch.

  • Multi-Sensor Fusion: High-density interconnects allow 20+ sensors to talk to the board simultaneously, with signal synchronization precision down to ±1ns. Perfect for complex 3D vision measurement.

  • Anti-Interference Design: Embedded shield cavities and a "forest" of grounding vias isolate internal EMI noise, ensuring your inspection accuracy is never compromised.

Part 4: What Truly Sets Us Apart

1. Our "Trinity" Reliability Guarantee

We don't just look at one thing. We synergize Materials, Structure, and Process:

• Material-Level: High-purity substrates with low CTE design ensure the board's size stays stable across wide temperature ranges.

• Structure-Level: Redundant circuit design and local reinforcement mean if one path fails, the system finds another. It keeps running.

• Process-Level: Full-process quality monitoring with complete batch traceability. Our defect rate is a razor-thin <50 PPM.

2. Mastery Over High-Frequency Signals

• Tighter Impedance Control: We hold ±3% tolerance, beating the typical ±5% industry standard. This is a big deal for clean data transmission at 10Gbps and beyond.

• Lower Signal Loss: Using low-profile rolled copper and laser microvias, we cut signal loss at 10GHz by 35%, giving you a 12dB boost in signal-to-noise ratio.

• Smarter Parasitic Control: Our blind via design eliminates via stubs, boosting signal integrity by 20% and cutting down signal delay by 15%.

3. The Best Bang for Your Buck

We get that performance needs to be affordable.

• Hybrid Material Strategy: Use premium high-frequency material only for critical signal layers. Use cost-effective High Tg FR4 for the rest. You save up to 30% with less than 5% performance impact. It's a win-win.

• Modular Design Philosophy: We create a standardized HDI core and then customize the periphery. This slashes your design cycle time by 50% and cuts production costs by 25%.

• Domestic Alternative Solutions: Where it makes sense, we use high-performance domestic materials (like Shengyi's S1000 series) to replace expensive imports. This can cut your material costs by a whopping 40% without sacrificing the specs you need.

Part 5: Wrapping It Up - The "Digital Backbone" for Smart Factories

Caboer's Industrial HDI, High-Frequency & High-Speed PCBs are more than just components. Through material innovation, structural optimization, and process mastery, they've become the core "nervous system" for the smart equipment driving Industry 4.0. Here’s the value we deliver:

• Rock-Solid Reliability: Your equipment keeps running for years (MTBF≥10 years) in the toughest conditions: extreme cold or heat, strong vibration, and humid environments.

• Blazing-Fast Data: We support 10Gbps+ data rates and sub-1ms response times, meeting the real-time demands of modern industrial control.

• Space Savings & More Features: High-Density Interconnect (HDI) technology can shrink your device size by 50% while packing in 30% more functionality.

• Real Cost Advantage: Through our material and process innovations, we deliver performance that rivals international brands but at a 20-40% lower price point, helping to accelerate the adoption of automation everywhere.

In the rising tide of smart manufacturing, Caboer's PCBs are the critical link connecting physical industrial equipment to the digital world. We're here to be your partner, helping power the leap from "Made in China" to "Intelligently Made in China" – and everywhere else. Let's build the future of automation, together.