| Process capability table updated: 2026 | |||
| Serial Number | Key Projects | Sample processing capability | Mass production process capability |
| 1 | Product Type |
Flexible circuit board:Single-sided board, double-sided board, layered board, perforated board, multi-layer board, Rigid-flex PCB:Double-sided boards, multilayer boards (layered structure, adhesive structure), HDI boards, and other special boards: metal substrates |
Flexible circuit board:Single-sided board, double-sided board, layered board, perforated board, multi-layer board, Rigid-flex PCB:Double-sided boards, multilayer boards (layered structure, adhesive structure), HDI boards, and other special boards: metal substrates |
| 2 | number of floors | Through-hole plates: Flexible plates: 1-12 layers; Rigid-flexible plates: 2-32 layers; Blind buried plates (Level 3): 3-32 layers | Through-hole plates: Flexible plates: 1-8 layers; Rigid-flex plates: 2-20 layers; Blind buried plates (Level 2): 3-20 layers |
| 3 | Finished board dimensions (maximum) | Single-sided board: 250*10000mm; Double-sided board: 250*5000mm; Multi-layer board: 250*1200mm; Rigid-flex board: 250*1200mm | Single-sided board: 250*500mm; Double-sided board: 250*500mm; Multi-layer board: 250*500mm; Rigid-flex board: 500*450mm |
| 4 | Finished board size (minimum) | Flexible board: 2*2mm; Rigid-flex board: 5*5mm | Flexible board: 2*2mm; Rigid-flex board: 5*5mm |
| 5 | Plate thickness range | Flexible board: 0.04mm-1.0mm; Rigid-flex board: 0.3-4.0mm | Flexible board: 0.06mm-0.4mm; Rigid-flex board: 0.3-4.0mm |
| 6 | Finished plate thickness tolerance | Flexible board: ±0.03mm; Rigid-flex board: ±6% | Flexible board: ±0.05mm; Rigid-flex board: ±10% |
| 7 | Design line width/spacing (minimum) | 6µm copper thickness: 0.03/0.03mm; 9µm copper thickness: 0.05/0.05mm; 12µm copper thickness: 0.06/0.06mm | 9µm copper thickness: 0.05/0.05mm; 12-18µm copper thickness: 0.075/0.075mm; ≥20µm copper thickness: 0.09/0.09mm |
| 8 | Line width tolerance | Impedance line: ±8% Non-impedance line: ±15% | Impedance line: ±10% Non-impedance line: ±20% |
| 9 | Minimum spacing between hole and wire | 3-6 layers: 6mil; 7-12 layers: 8mil; 13-18 layers: 10mil; 18 layers and above: 12mil | 3-6 layers: 7mil; 7-12 layers: 9mil; 13-18 layers: 11mil; 18 layers and above: 13mil |
| 10 | Minimum pad | Isolated/BGA pads: 0.2mm; Non-isolated interconnect pads: 0.15mm. | Isolated/BGA pads: 0.25mm; Non-isolated interconnect pads: 0.2mm. |
| 11 | Minimum distance between metallized hole and rigid-flexible bonding edge | 0.5mm | 0.8mm |
| 12 | Flexible board substrate material | PI (polyimide), PET (polyester), PTFE (polytetrafluoroethylene), LCP (liquid crystal polymer) | PI (polyimide), PET (polyester) |
| 13 | Flexible PCB substrate manufacturers | Shengyi/Taihong/Xinggao/Panasonic/DuPont | Shengyi/Taihong/Xinggao/Panasonic/DuPont |
| 14 | Copper foil thickness | Copper foil thickness: 6um/9um/12um/18um/35um/70um/100um/125um/150um | Copper foil thickness: 9um/12um/18um/35um/70um/100um/125um/150um |
| 15 | Covering film thickness | 13um/ 27.5um/37.5um/50um/75um/100um/125um/150um | 27.5um/37.5um/50um/75um/100um/125um/150um |
| 16 | Through-hole copper thickness: | Double-sided flexible boards: multilayer boards with a thickness of 10µm or more; rigid-flex boards: 20µm or more | Double-sided flexible boards: multilayer boards with a thickness of 10µm or more; rigid-flex boards: 20µm or more |
| 17 | Aspect Ratio | 16:01 | 8:01 |
| 18 | Minimum diameter of CNC drilling | 0.1mm | 0.1mm |
| 19 | Minimum diameter for laser drilling | 0.05mm | 0.075 mm |
| 20 | Minimum diameter of semi-circular hole | Φ=0.4mm | Φ=0.4mm |
| 21 | Aperture tolerance |
PTH: +0.08/-∞ (Φ≤0.3mm); ±0.08 (0.31＜Φ≤0.8mm); ±0.10 (0.8＜Φ≤1.6mm); ±0.15 (1.6＜Φ≤2.5mm); +0.15/-0 (2.5＜Φ≤6.0mm) NPTH: ±0.05 (Φ≤0.8mm); ±0.08 (0.8＜Φ≤1.6mm); +0.10/-0 (1.6＜Φ≤6.0mm) |
PTH: +0.08/-∞ (Φ≤0.3mm); ±0.08 (0.31＜Φ≤0.8mm); ±0.10 (0.8＜Φ≤1.6mm); ±0.15 (1.6＜Φ≤2.5mm); +0.15/-0 (2.5＜Φ≤6.0mm) NPTH: ±0.05 (Φ≤0.8mm); ±0.08 (0.8＜Φ≤1.6mm); +0.10/-0 (1.6＜Φ≤6.0mm) |
| 22 | Hole position tolerance | ±0.1 mm | ±0.1 mm |
| 23 | Punching hole diameter tolerance | ±0.05mm | ±0.05mm |
| 24 | Laser shape tolerance | ±0.03mm | ±0.05mm |
| 25 | Die stamping shape tolerance | Slow wire EDM die: ±0.05mm; Medium wire EDM die: ±0.075mm; Fast wire EDM die: ±0.1mm | Slow wire EDM die: ±0.05mm; Medium wire EDM die: ±0.075mm; Fast wire EDM die: ±0.1mm |
| 26 | grooving tolerance | ±0.1mm (0.05mm at local locations) | ±0.1mm |
| 27 | V-cut thickness | ±0.07mm | ±0.1mm |
| 28 | Warp | Symmetrical structure: 0.75% Asymmetrical structure: 1.5% | Symmetrical structure: 0.75% Asymmetrical structure: 1.5% |
| 29 | Reinforcement type and thickness | FR4: 0.1-3.0 mm; PI: 0.075-0.275 mm; PET: 0.2-0.225 mm; Steel sheet: 0.1-0.6 mm; Aluminum sheet: 0.1-2.0 mm. | FR4: 0.1-3.0 mm; PI: 0.075-0.275 mm; PET: 0.2-0.225 mm; Steel sheet: 0.1-0.6 mm; Aluminum sheet: 0.1-2.0 mm. |
| 30 | Length of overflow | CVL: 0.1-0.15mm PP: 0.5mm | CVL: 0.1-0.15mm PP: 1mm |
| 31 | Minimum length of flexible circuit board area | 2mm | 5mm |
| 32 | Types of surface finishes that can be made | Immersion gold/nickel palladium gold/gold plating/immersion silver/immersion tin/OSP/plating tin | Immersion gold/nickel palladium gold/gold plating/immersion silver/immersion tin/OSP/plating tin |
| 33 | Immersion gold: Thick gold, thick nickel; Immersion nickel palladium: Thick palladium. | AU: 0.025-0.125um Ni: 1-6um Pd: 0.025-0.125um | AU: 0.025-0.125um Ni: 1-6um Pd: 0.025-0.125um |
| 34 | Electroplated nickel-gold: gold thick, nickel thick | AU: 0.025-5um Ni: 1-7um | AU: 0.025-5um Ni: 1-7um |
| 35 | Electroplating dry film (W220) | ≥3MIL dry membrane bridge | ≥4MIL dry membrane bridge |
| 36 | Tin plating (Sn): | 0.1-0.6um | 0.1-0.4um |
| 37 | OSP thickness | 0.1-0.7um | 0.1-0.5um |
| 38 | Lead-free tin plating thickness | 1-40um | 2-20um |
| 39 | Lead-plated tin thickness | 1-40um | 2-20um |
| 40 | immersion silver thickness | ≥0.15um | ≥0.15um |
| 41 | Character silkscreen tolerance | ±0.1mm | ±0.1mm |
| 42 | Minimum line width of characters | 0.08mm | 0.1mm |
| 43 | Minimum character height/width | 0.5mm | 0.6mm |
| 44 | Minimum width of weld bridge | Green oil, butter, red oil, blue oil: 0.1mm; white oil, black oil: 0.125mm | Green oil, butter, red oil, blue oil: 0.1mm; white oil, black oil: 0.125mm |
| 45 | Finished Product Impedance Control | ±7% | ±10% |
| 46 | Peel strength | ≥0.8kg/cm² | ≥0.8kg/cm² |
| 47 | Temperature resistance | PET material: 100℃; PI material: 200℃ ~ 350℃ | PET material: 100℃; PI material: 200℃ ~ 350℃ |
| 48 | Executable acceptance criteria | Civilian products: IPC-6012, IPC-6013, IPC-A-600; Military products: GJB 7548A-2021, QJ-831B-2011 | |
| 49 | Product UL Certification | Both flexible printed circuit boards (FPCBs) and rigid-flex PCBs have UL certification. | |
| 50 | System Certification | ISO9001-2015/ISO14001/ISO45001-2018/IATF 16949/ISO13485-2016/GJB9001C-2017 | |
| 51 | Packaging | Blister boxes, electrostatic packaging bags, micro-adhesive film continuous packaging, bundled packaging | |
SMT YRM10 surface mount technology process capability table
| The YRM10 is Yamaha's new generation of compact, high-speed, modular chip mounters, positioned for mid-to-high-end mass production lines, emphasizing high efficiency and high precision per head. | ||
| With wide component coverage and yield control, it is suitable for medium-to-high density SMT processes in consumer electronics, industrial control, medical, and automotive electronics. | ||
| I. Basic Equipment Parameters | ||
| Serial Number | project | Standard Specifications |
| 1 | Equipment Model | YRM10 |
| 2 | Equipment type | High-speed general-purpose placement machine |
| 3 | Theoretical placement speed | 52000 CPH |
| 4 | Mass production stability speed | 42000～48000CPH |
| 5 | Mounting method | Multi-nozzle parallel placement |
| II. PCB Substrate Size Specifications | ||
| Serial Number | project | Standard Specifications |
| 1 | Maximum PCB size | 420mm×330mm |
| 2 | Minimum PCB size | 50mm×50mm |
| 3 | PCB thickness | 0.4mm～4.0mm |
| 4 | Allowable PCB warpage | ≤0.5mm |
| III. Component Compatibility Range | ||
| Serial Number | Component type | Specifications range |
| 1 | Minimum chip element | 0201 (0.6×0.3mm) |
| 2 | Conventional resistor-capacitor components | 0402/0603/0805/1206 |
| 3 | Largest square IC | 100mm×55mm |
| 4 | Minimum spacing of component pins | 0.35mm |
| 5 | Maximum height of component | ≤15mm |
| 6 | Packaging adapter | SOT/SOP/QFN/QFP/BGA/PLCC/Connectors/Shielding Frames |
| IV. Mounting accuracy | ||
| Serial Number | project | Precision Specifications |
| 1 | X/Y axis mounting accuracy | ±35μm |
| 2 | θ rotation accuracy | ±0.025° |
| 3 | Repeatability | ±0.015mm |
| V. Material supply capacity of the material station | ||
| Serial Number | project | Specification |
| 1 | Number of standard material stations | 48 stations (8mm feeder) expandable |
| 2 | Supports feeder specifications | 8/12/16/24/32mm tape/strip, coil packaging |
|
Remark: The above process capabilities apply to both sample production and mass production. |
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