Ultra-thin 0.1mm Fingerprint FPC Board for Cell Phone_Precipitated Nickel Gold Finish_Multilayer Flexible Circuit Board Manufacturer-Pcb Manufacturer, Rigid Flex Pcb, Flexible Pcb

Mobile Phone Fingerprint Recognition FPC Board

Mobile Phone Fingerprint Recognition FPC Board
Brief Introduction
Type: Mobile phone fingerprint recognition flexible board
Minimum Line Width/Spacing: 0.07mm/0.07mm
Layers: 2 layers
Thickness: 0.1mm
Surface Treatment: Immersion nickel gold
Capel’s Services
Supports customization of 1-30 layer FPC flexible PCBs, 2-32 layer rigid-flex PCBs, and 1-60 layer rigid PCBs.
Reliable rapid-turnaround PCB prototype manufacturing.
Fast SMT PCB assembly.
Industries We Serve
Medical equipment, Internet of Things (IoT), TWS, drones, aviation, automotive, telecommunications, consumer electronics, military, aerospace, industrial control, artificial intelligence, electric vehicles, etc.
If you have related needs, please feel free to send us an e-mail by clicking the button below.

Type: Mobile Phone Fingerprint Recognition Flexible Board. It boasts excellent flexibility, allowing it to perfectly fit the complex and compact spatial layout inside mobile phones. Whether integrated with side buttons or used in under-screen fingerprint recognition modules, it adapts flexibly, providing strong support for the lightweight design and functional integration of the overall mobile phone.

Minimum Line Width/Spacing: Reaching a precise level of 0.07mm/0.07mm. This sophisticated line width and spacing design enables denser and more accurate wiring within the limited board space. It is crucial for the fast and accurate transmission of weak electrical signals during fingerprint recognition, effectively ensuring high sensitivity and precision of fingerprint recognition and allowing users to complete the unlocking operation instantly.

Layers: 2 layers. The 2-layer structural design meets the circuit functional requirements for fingerprint recognition while maintaining the lightweight and thin characteristics of the FPC board. The double-layer structure reasonably plans signal transmission lines, power lines, etc., reducing signal interference and improving the stability and reliability of the overall circuit.

Thickness: 0.1mm. With an ultra-thin thickness of only 0.1mm, it frees up valuable space for other key components in the space-constrained interior of mobile phones. This helps mobile phones achieve a more lightweight and slim design, enhancing users' grip comfort and portability.

Surface Treatment: Adopting the immersion nickel-gold process. The nickel layer can effectively prevent oxidation of the copper layer, enhance the corrosion resistance of the circuit board, and extend its service life; the gold layer, with excellent conductivity and solderability, ensures stable and reliable electrical connections between the fingerprint recognition sensor and the FPC board, as well as between the FPC board and the mobile phone motherboard, reducing signal transmission loss and improving the overall performance of the fingerprint recognition system.

Capel Flexible PCB & Rigid-Flex PCB Process Capability

Category	Process Capability	Category	Process Capability
Production Type	Single layer FPC / Double layers FPC Multi-layer FPC / Aluminum PCBs Rigid-Flex PCB	Layers Number	1-30 layers FPC 2-32 layers Rigid-FlexPCB 1-60 layers Rigid PCB HDI Boards
Max Manufacture Size	Single layer FPC 4000mm Double layers FPC 1200mm Multi-layers FPC 750mm Rigid-Flex PCB 750mm	Insulating Layer Thickness	27.5um /37.5/ 50um /65/ 75um / 100um / 125um / 150um
Board Thickness	FPC 0.06mm - 0.4mm Rigid-Flex PCB 0.25 - 6.0mm	Tolerance of PTH Size	±0.075mm
Surface Finish	Immersion Gold/Immersion Silver/Gold Plating/Tin Plating/OSP	Stiffener	FR4 / PI / PET / SUS / PSA/Alu
Semicircle Orifice Size	Min 0.4mm	Min Line Space/ width	0.045mm/0.045mm
Thickness Tolerance	±0.03mm	Impedance	50Ω-120Ω
Copper Foil Thickness	9um/12um / 18um / 35um / 70um/100um	Impedance Controlled Tolerance	±10%
Tolerance of NPTH Size	±0.05mm	The Min Flush Width	0.80mm
Min Via Hole	0.1mm	Implement Standard	GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III

Capel manufactures customized high-precision Rigid Flexible Circuit Board / Flexible PCB / HDI PCB with 15 years of experience with our professionalism

2 Layer Flexible PCB Boards Stackup

4 Layer Rigid-Flex PCB Stackup

8 layer HDI PCBs

Testing And Inspection Equipment

Microscope Testing

AOI Inspection

2D Testing

Impedance Testing

RoHS Testing

Flying Probe

Horizontal Tester

Bending Teste

Capel provide customers customized PCB Service with 15 years of experience

Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.