Type: Flexible Printed Circuit (FPC) for POS antenna, specially designed for POS wireless communication, with excellent flexible bending performance. Whether it is the built-in antenna layout of handheld mobile POS machines or the integration of multiple antennas in desktop POS terminals, it can be flexibly adapted to the compact space inside the equipment (e.g., the edge of the body, the battery compartment periphery) to realize the efficient transmission of multi-frequency band signals, replacing the traditional rigid antenna wiring and enhancing the stability of the equipment's communication.

Minimum line width / line spacing: 0.1mm/0.2mm high precision standard. This parameter is optimized for the multi-band signal characteristics of POS: 0.1mm line width ensures lower transmission loss of high-frequency signals (e.g. Bluetooth 5.0, NFC 13.56MHz), 0.2mm line spacing reserves space for parallel wiring of multiple antennas, supports the independent transmission of 4G and Bluetooth signals, avoids inter-band interference, and ensures real-time uploading of transaction data without delay.

Layers: 2-layer structure design, through scientific layering to achieve fine signal management:

Signal Layer: Differential routing design, optimize 4G LTE signal impedance matching (target impedance 50Ω±10%), reduce signal reflection;

Grounding Layer: Large copper foil coverage, forming a stable reference plane, enhance the antenna radiation efficiency, and at the same time, shield the POS internal battery, motherboard and other components of the electromagnetic interference to ensure the purity of the signal. Ensure signal purity.

Two-layer synergy significantly reduces the risk of multi-band signal crosstalk, especially suitable for POS devices that support “wireless payment + data upload” dual-mode function.

Thickness: 0.20mm thin and light, perfectly adapted to the needs of POS machine compact structure. Under the trend of “thin and light” design of handheld POS devices (e.g. body thickness <15mm), it can significantly reduce the space occupied by the antenna module, freeing up space for core components such as the battery and touch screen, and at the same time, improve the flexibility of bending the wiring when assembling the device and reduce production loss.

Surface treatment: the use of immersed gold 1 micro-inch process, through precise control of nickel-gold plating thickness (nickel layer ≥ 3μm, gold layer ≥ 0.025μm), to bring multiple advantages:

excellent conductivity of the gold layer, reducing high-frequency signal transmission loss (especially in the NFC near-field communication, to enhance the signal sensing sensitivity);

1 micro-inch precision gold layer thickness balance between corrosion resistance and cost, to adapt to the POS machine long-term use of daily wear and tear, perspiration erosion (particularly in NFC near-field communications, enhance signal sensitivity); 1 micro-inch precision gold layer thickness balance of corrosion resistance and cost, to adapt to POS machine long-term use of the Daily wear and tear, sweat erosion (handheld scenarios) and other environmental factors;

Enhance the reliability of the solder joints to ensure stable contact between the wires and the antenna module, the motherboard, and the soldered parts of the antenna module, to reduce the communication disconnection problems caused by poor contact.

Capel Flexible PCB & Rigid-Flex PCB Process  Capability

2 Layer Flexible PCB Boards Stackup

4 Layer Rigid-Flex PCB Stackup

8 layer HDI PCBs

Microscope Testing

AOI Inspection

2D Testing

Impedance Testing

RoHS Testing

Flying Probe

Horizontal Tester

Bending Teste

Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.