Date: 2026-02-06
The smartphone in your hand can be so slim and light because a circuit board the size of a fingernail may integrate connections for over a billion transistors inside—that's the magic of High-Density Interconnect technology.
In an era where electronic devices relentlessly pursue being lighter, thinner, and more powerful, High-Density Interconnect (HDI) PCB has become an indispensable core component. From AI servers processing massive data per second to elegantly folding smartphones, HDI technology plays a crucial role behind the scenes.
Market research indicates that the global HDI market size reached approximately $10.89 billion in 2024 and continues to grow, driven by demands from AI, 5G communication, and other sectors. Particularly in the AI server segment, the HDI PCB market is projected to grow from about $506 million in 2024 to $844 million by 2031, with a compound annual growth rate (CAGR) of 6.7%.
Imagine a traditional PCB (Printed Circuit Board) as a small town, with circuits being the roads between towns. An HDI PCB, in contrast, is like a super metropolis. Within the same area, it achieves connection density and signal transmission efficiency far surpassing traditional PCBs through finer "roads" (circuits) and three-dimensional "overpasses" (microvias).
Simply put, HDI PCBs utilize advanced drilling technologies like microvias, buried vias, and blind vias, along with finer lines and spacing, to achieve more interconnections per unit area.
This allows electronic devices to integrate more functionality within a smaller space while enhancing signal transmission speed and integrity.
The key to achieving HDI lies in its core process: microvia technology. You can think of microvias as "micro-elevators" connecting different circuit layers; they are much smaller than the through-holes on traditional PCBs.
The diameter of these microvias is typically less than 150 microns (about the width of two human hairs) and is processed through precision techniques like laser drilling. Microvia technology mainly includes several types: Blind Vias (connecting from the surface layer to an inner layer without going through the entire board), Buried Vias (completely hidden inside the board, connecting two or more inner layers).
as well as more complex structures like Stacked Vias and Staggered Vias. This intricate network of "micro-elevators" allows signals to travel between different circuit layers via shorter paths with less interference, forming the foundation for the high performance of HDI PCBs.
HDI PCBs are not all the same. Based on the complexity of inter-layer connections and technical grade, they can be mainly divided into several types to meet different needs, from consumer electronics to high-end communication equipment.
1+N+1 HDI: This is the entry-level high-density interconnect board, adding one high-density interconnect layer on each side of the core "N" layers of traditional PCB. It's like putting two layers of high-performance "clothing" on a traditional PCB. Consumer electronic products like smartphones and tablets widely use this type of HDI to save space.
2+N+2 HDI: This type has two HDI layers on each side of the core layer, offering higher interconnection density and design flexibility. It is suitable for equipment with more stringent signal integrity requirements, such as high-end routers, communication base stations, and some automotive electronic systems.
Every Layer Interconnection (ELIC): This is currently the most advanced HDI technology, where any layer of the PCB can be directly connected to any other layer via microvias. This structure provides maximum design freedom and optimal electrical performance. It is primarily used in cutting-edge fields like top-tier smartphones, artificial intelligence (AI) accelerator cards, and high-performance computing (HPC) chips.
Why are modern high-end electronic devices turning to HDI? Because it addresses several fundamental bottlenecks that traditional PCB technology faces on the path to miniaturization and high performance.
The foremost advantage is space saving. Through microvias and fine lines, HDI PCBs can achieve the same or even more complex functions on a smaller board area. This makes increasingly thinner smartphones and smaller wearable devices possible.
Next is the significant improvement in electrical performance. Shorter interconnection paths mean lower signal delay, less energy loss, and stronger signal integrity. This is crucial for 5G communication equipment, data center servers, and autonomous driving sensors that handle high-speed data streams.
Furthermore, HDI technology can increase design flexibility. Engineers can more freely layout components and circuits in three-dimensional space, providing more possibilities for product innovation. It also helps enhance system reliability by reducing many traditional connectors and high-density solder joints, which are often failure points in devices.
Designing and manufacturing HDI PCBs is a highly specialized engineering task involving precision materials science, complex chemical processes, and cutting-edge laser processing technology. Unlike choosing a traditional PCB manufacturer, selecting an HDI partner requires more careful consideration.
A professional HDI manufacturer can not only provide boards that meet specifications but also become a partner in your product's success. They can engage during the design phase, offering Design for Manufacturability (DFM) analysis to identify and mitigate production risks early, optimizing the design to balance performance, reliability, and cost.
Facing a globalized supply chain, professional manufacturers possess stable raw material procurement channels and mature production management systems, ensuring consistent quality and timely delivery from prototypes to mass production. Especially in today's rapidly evolving technological landscape, their continuous R&D investment can help you seize forefront market opportunities like AI servers and new energy automotive electronics.
After understanding the importance and complexity of HDI PCBs, choosing a trustworthy manufacturer becomes key. Kaboer is rooted in Shenzhen, China—one of the core areas of global electronics manufacturing. We own our advanced PCBA factory, specializing in the R&D and manufacturing of flexible circuit boards, rigid-flex boards, and high-frequency, high-speed HDI PCBs.
We deeply understand that an excellent circuit board is the cornerstone of product reliability. Therefore, we don't just sell products; we provide a one-stop solution encompassing design support, precision manufacturing, and component assembly (PCBA).
Our technical team excels at tackling the challenges posed by high-density interconnections, ensuring that even complex designs like "Every Layer Interconnection" can be precisely realized.
We understand that for international clients, trust is built on transparency. We sincerely invite you to visit our factory in Shenzhen for an on-site inspection. You can see our production environment, equipment, processes, and quality control systems with your own eyes, have face-to-face discussions with our engineers, and proceed with every collaboration with full confidence.
At Kaboer, we will continue to focus on advanced circuit technologies required for fields like flexible electronics, automotive electronics, and high-end communication equipment. We look forward to becoming a solid support for your global market expansion with reliable manufacturing capabilities, responsive service, and a transparent, trustworthy partnership.
Under Shenzhen's night sky, countless ideas are illuminated on circuit boards. Inside precision equipment, signals race along lines one-hundredth the width of a human hair, connecting the boundaries between the virtual and the real.
Choosing the right technology partner means your innovative product gets a passport from blueprint to the global market. When performance, reliability, and miniaturization become key to competition, High-Density Interconnect technology and the manufacturing experts behind it are quietly supporting the next wave of transformation.
Kaboer manufacturing PCBs since 2009. Professional technology and high-precision Printed Circuit Boards involved in Medical, IOT, UAV, Aviation, Automotive, Aerospace, Industrial Control, Artificial Intelligence, Consumer Electronics etc..
English
Wechat
+86 13670210335
+86 13670210335
E-mail