Solar Antenna Double-Sided Flexible PCB
Solar Antenna Double-Sided Flexible PCB
  • Solar Antenna Double-Sided Flexible PCB
  • Solar Antenna Double-Sided Flexible PCB
  • Solar Antenna Double-Sided Flexible PCB
  • Solar Antenna Double-Sided Flexible PCB
  • Solar Antenna Double-Sided Flexible PCB
  • Solar Antenna Double-Sided Flexible PCB
  • Solar Antenna Double-Sided Flexible PCB
  • Solar Antenna Double-Sided Flexible PCB
  • Solar Antenna Double-Sided Flexible PCB
  • Solar Antenna Double-Sided Flexible PCB

Brief Introduction:

Type: Double-sided board

Material: Double-sided adhesive-free laminated 12/12.5, double-sided yellow cover film 27.5μm

Number of Layers: 2 layers

Board Thickness: 0.09mm

Surface Finish: Chemically Gold 3μm

Capel Services:

Custom FPC Flexible PCBs (1-30 layers), Rigid-Flex PCBs (2-32 layers), Rigid PCBs (1-60 layers), Reliable Rapid Turn PCB Prototyping, Fast SMT PCB Assembly

Industries We Serve:

Medical devices, IoT, TUT, drones, aviation, automotive, telecommunications, consumer electronics, military, aerospace, industrial control, artificial intelligence, electric vehicles, and more...

If you have related needs, please click the button below to send us an email.




Capel’s double-sided flexible PCB for solar antennas is a core circuit component tailored for antennas supporting solar photovoltaic systems (such as signal transmission antennas and positioning antennas). It features an ultra-thin flexible structure and high reliability to ensure signal transmission and energy synergy in complex outdoor environments. Adopting a 2-layer double-sided board design with a precisely controlled thickness of 0.09mm, its extreme thinness and flexibility allow it to fit tightly to the curved surface of solar panels or bracket structures, adapting to the compact installation layout of photovoltaic systems. It neither affects the light absorption efficiency of solar panels nor resists bending and fitting operations during outdoor installation, meeting the lightweight design needs of distributed photovoltaics and portable solar equipment.

In terms of core materials and performance guarantee, it uses double-sided adhesive-free rolled 12/12.5 substrate. The 12μm ultra-thin rolled copper foil has a regular crystal structure, offering excellent conductivity and extremely low signal transmission loss. It can accurately carry high-frequency signals of the antenna (such as 4G/5G data transmission and GPS positioning signals) while being compatible with low-power control signals of solar systems, avoiding signal interference that affects the remote monitoring and scheduling of photovoltaic equipment. The surface is covered with 27.5μm double-sided yellow coverlay, which has strong insulation, weather resistance, and UV resistance. It can resist outdoor high temperatures, rain, dust, and UV erosion, preventing PCB aging and cracking and extending service life. The 3 microinches (approximately 0.0762μm) immersion gold surface treatment creates a uniform and thick gold layer, significantly improving the contact stability between pads, antenna interfaces, and connectors, and reducing contact resistance. Even under long-term outdoor exposure to wind and sun or severe temperature fluctuations (-30℃ to 85℃), it can ensure accurate and stable signal transmission, providing reliable circuit support for the efficient operation and remote management of solar systems.

Capel Flexible PCB & Rigid-Flex PCB Process  Capability

CategoryProcess CapabilityCategoryProcess Capability
Production TypeSingle layer FPC / Double layers FPC
Multi-layer FPC / Aluminum PCBs
Rigid-Flex PCB
Layers Number1-30 layers FPC
2-32 layers Rigid-FlexPCB
1-60 layers Rigid PCB
HDI Boards
Max Manufacture SizeSingle layer FPC 4000mm
Double layers FPC 1200mm
Multi-layers FPC 750mm
Rigid-Flex PCB 750mm
Insulating Layer
Thickness
27.5um /37.5/ 50um /65/ 75um / 100um /
125um / 150um
Board ThicknessFPC 0.06mm - 0.4mm
Rigid-Flex PCB 0.25 - 6.0mm
Tolerance of PTH
Size
±0.075mm
Surface FinishImmersion Gold/Immersion
Silver/Gold Plating/Tin Plating/OSP
StiffenerFR4 / PI / PET / SUS / PSA/Alu
Semicircle Orifice SizeMin 0.4mmMin Line Space/ width0.045mm/0.045mm
Thickness Tolerance±0.03mmImpedance50Ω-120Ω
Copper Foil Thickness9um/12um / 18um / 35um / 70um/100umImpedance
Controlled
Tolerance
±10%
Tolerance of NPTH
Size
±0.05mmThe Min Flush Width0.80mm
Min Via Hole0.1mmImplement
Standard
GB / IPC-650 / IPC-6012 / IPC-6013II /
IPC-6013III
Capel manufactures customized high-precision Rigid Flexible Circuit Board / Flexible PCB / HDI PCB with 15 years of experience with our professionalism
2 Layer Flexible PCB Boards Stackup
4 Layer Rigid-Flex PCB Stackup
8 layer HDI PCBs
Testing And Inspection Equipment
Microscope Testing
AOI Inspection
2D Testing
Impedance Testing
RoHS Testing
Flying Probe
Horizontal Tester
Bending Teste
Capel provide customers customized PCB Service with 15 years of experience
Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.









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Capel manufacturing PCBs since 2009. Professional technology and high-precision Printed Circuit Boards involved in Medical, IOT, UAV, Aviation, Automotive, Aerospace, Industrial Control, Artificial Intelligence, Consumer Electronics etc..

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CONTACT US

    Shenzhen Capel Technology Co., Ltd. +86 13670210335 sales06@kbefpc.com +86 13670210335 +86 13670210335

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