Capacitive FPC is the core component connecting the touch module and the motherboard in the touch interaction experience of tablet PCs, and its performance directly affects the touch sensitivity, signal response speed, and smoothness of operation.Capel's capacitive FPC for tablet PCs has become the preferred solution for connecting touch circuits in the consumer electronics field due to its fine process design and reliable performance.

Type: Tablet PC capacitive special flexible circuit board (FPC), designed for flat panel touch module, with excellent flexible bending performance. Whether it is the edge touch area of a full-screen tablet or a touch panel that supports pressure-sensitive operation, it can be flexibly adapted to the complex wiring space inside the device to realize the accurate conduction of touch capacitive signals, replacing the traditional rigid wiring and enhancing the touch experience of the device.

Minimum line width/spacing: 0.096mm/0.1mm high precision standard. This parameter is optimized for the weak characteristics of flat panel touch capacitance signals, which can arrange dense and precise lines in the limited wiring space to ensure fast and distortion-free transmission of touch sensing signals (e.g., capacitance changes caused by finger contact), guaranteeing the sensitivity and accuracy of touch operation, and avoiding delayed or erroneous touches.

Layer: 2-layer structure design, through a reasonable division of the signal layer and grounding layer, to achieve stable transmission of touch signals. The signal layer focuses on the accurate transmission of capacitive sensing signals, while the grounding layer effectively shields the external electromagnetic interference (such as signal interference from the motherboard and battery inside the tablet). The synergy of the two layers significantly reduces the risk of signal crosstalk, which is especially suitable for high-end tablet scenarios with high requirements for touch accuracy.

Thickness: The ultimate thinness of only 0.12mm is perfectly suited to the thin and light design requirements of tablet PCs. In the structure of flat panel internal space, it can significantly reduce the space occupied by the wires around the touch module, helping the device to realize a slimmer body design, and at the same time, reduce the bending difficulty of the wires in the assembly process, and improve the production efficiency.

Surface treatment: the use of immersion gold technology, through the uniform deposition of nickel-gold plating on the surface of the copper layer, to bring multiple advantages:

excellent conductivity of the gold layer, reducing the loss of weak touch signal transmission process, to protect the signal integrity;

Enhance the line's corrosion and abrasion resistance, to adapt to long-term use of the plate of the daily wear and tear, temperature and humidity changes in the environment and other factors;

to enhance the welding point of the welding and reliability, to ensure stable contact between the wires and touch module, motherboard and welding parts. Enhance the solderability and reliability of the solder joints to ensure stable contact between the wires and the touch module and the motherboard, and reduce the touch malfunction caused by poor contact.

Capel Flexible PCB & Rigid-Flex PCB Process  Capability

2 Layer Flexible PCB Boards Stackup

4 Layer Rigid-Flex PCB Stackup

8 layer HDI PCBs

Microscope Testing

AOI Inspection

2D Testing

Impedance Testing

RoHS Testing

Flying Probe

Horizontal Tester

Bending Teste

Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.