Type: Flexible Printed Circuit (FPC) for Tablet PC Antenna

Designed for tablet PC wireless communication module, it serves as the core carrier of antenna signal transmission and supports multi-band wireless technologies such as Wi-Fi 6E, Bluetooth 5.3, 5G NR, and so on. Its flexible characteristics allow the antenna to be flexibly laid out in the complex space inside the tablet, such as edge bending and laminating, and integrating multiple antenna arrays to optimize signal reception and radiation efficiency.

Minimum Line Width / Pitch: 0.3mm/0.2mm

This parameter balances high-frequency signal transmission with the difficulty of production process:

0.3mm line width ensures sufficient current carrying capacity and reduces signal transmission loss (especially in the high-frequency band of 2.4GHz/5GHz);

0.2mm line spacing meets the need for high-density cabling and supports multi-antenna integration design (e.g. multi-channel layout for MIMO technology).

Layers: 2-layer structure

Signal layer: Differential alignment design to reduce EMI and optimize high-frequency signal integrity;

Ground layer: Large-area copper foil grounding to provide a stable reference plane and enhance antenna radiation efficiency.

Thickness: 0.12mm

Advantages of ultra-thin design:

Reduce the space occupied by the antenna module, adapt to the trend of thin and light tablet PCs (e.g. Apple iPad Air thickness 6.1mm);

Enhance the flexibility of bending, support ≥ 5000 times of dynamic bending (to meet the tablet frequent opening and closing of the use of the scenario). 3.

Surface treatment process

immersion gold (ENIG):

nickel layer (thickness ≥ 3μm): block copper migration, improve the reliability of the solder joints;

gold layer (thickness ≥ 0.05μm):

excellent conductivity to reduce the signal attenuation (less skin effect at high frequencies);

anti-sulfur / oxidation characteristics, adapt to high temperature and high humidity environment (such as Southeast Asia market demand).

Capel Flexible PCB & Rigid-Flex PCB Process  Capability

2 Layer Flexible PCB Boards Stackup

4 Layer Rigid-Flex PCB Stackup

8 layer HDI PCBs

Microscope Testing

AOI Inspection

2D Testing

Impedance Testing

RoHS Testing

Flying Probe

Horizontal Tester

Bending Teste

Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.