Caboer’s 3-Layer Rigid-Flex PCB for Automotive Applications is tailor-made for core automotive components such as on-board radar, smart cockpit control modules, body electronic sensors, and vehicle communication terminals. It precisely addresses the core demands of automotive scenarios—resistance to extreme environments, strong vibration tolerance, stable signal transmission, and narrow space adaptation—delivering vehicle-grade robust performance as a trusted choice for automotive electronics R&D, and empowering automakers to create safer, smarter mobility experiences!

Adopting a 3-layer rigid-flex synergy structure, it perfectly balances adaptability and stability in automotive environments: the 0.225mm optimized flexible layer offers excellent bending toughness and fatigue resistance, flexibly fitting narrow wiring channels, curved body structures, and connections between moving parts inside vehicles. It easily avoids wiring interference and is compatible with installation in multiple areas (e.g., chassis, cockpit, trunk); the 0.75mm lightweight yet stable rigid layer meets automotive mounting standards, reliably supporting core components such as on-board chips, high-frequency connectors, and sensors. This achieves efficient integration of "flexible adaptation to complex vehicle structures + rigid fixation of precision parts". With precise dimensions of 217.4*20.3mm, the slender layout perfectly aligns with the "compact space, modular integration" design needs of automotive electronics, saving valuable space and freeing up room for other functional modules.

Key advantages directly tackle automotive scenario pain points, adding tangible value to product competitiveness: ① Full-board immersion gold finish provides superior temperature resistance (-40℃ to 125℃), oxidation resistance, and corrosion resistance, withstanding extreme temperature fluctuations, vibration impacts, and oil contamination in automotive environments. Low contact resistance ensures high-speed, distortion-free transmission of on-board signals (e.g., radar detection, communication data), meeting the long-term high-frequency operation requirements of vehicles; ② Solder mask with white text + through-hole design features clear markings, facilitating automated module assembly, rapid debugging, and post-maintenance—significantly improving production efficiency and operational convenience to meet the mass production needs of the automotive manufacturing industry; ③ 3-layer scientific wiring layout rationally separates signal, power, and ground layers, effectively suppressing electromagnetic interference (EMI). Even in complex on-board electromagnetic environments, it ensures stable multi-module collaboration, adapting to the full process of "environmental perception - data processing - command execution" and meeting vehicle-grade functional safety requirements.

Backed by Caboer’s vehicle-grade PCB R&D experience and strict quality control system, this 3-layer rigid-flex PCB can be customized for interface types, wiring routes, and protection schemes based on specific on-board equipment needs. Paired with rapid prototyping and efficient SMT assembly services, it helps automakers shorten R&D cycles and accelerate time-to-market. Whether for traditional fuel vehicles or new energy vehicles, whether for advanced driver assistance systems (ADAS) or in-vehicle entertainment terminals, it serves as the "core hub" of automotive electronics with stable performance—helping customers reduce after-sales risks and enhance brand reputation and market competitiveness!