Type: Flexible Printed Circuit (FPC) for cell phone camera, designed for front/rear camera module, with excellent flexible bending performance. Whether it is the built-in main camera with ultra-thin body, the telephoto lens supporting optical image stabilization (OIS), or the image system with multi-camera combination, the FPCs can flexibly adapt to the complex spatial layout inside the cell phone (e.g., the edges of the lens module, the bending transition area between the motherboard and the camera) to realize the precise transmission of image signals, and provide stable circuitry to support the functions of high-definition photography, 4K video recording, and night scene mode.

Minimum line width/line spacing: 0.1mm/0.08mm high precision standard. This parameter is optimized for the high-frequency image signal characteristics of cell phone cameras: 0.1mm line width ensures high-speed transmission of high-definition image data (e.g., 100 megapixel photos, 8K video), while 0.08mm line spacing realizes dense wiring within the limited space of the wiring and supports parallel transmission of multi-channel signals (e.g., independent transmission of signals from the main camera and the depth-of-field lens), which reduces imaging delays due to signal congestion and ensures clear details and no shading on the screen. Details are clear and free of ghosting.

Layers: 2-layer structure design, through scientific layering to achieve fine signal management:

Signal layer: Differential routing design to optimize the transmission path of image data and focus control commands, to adapt to the camera's high-bandwidth signal requirements (such as tens of gigabytes of image data transmission per second);

Ground layer: Large-area copper foil cover, forming a stable electromagnetic shielding barrier, effectively isolating the phone's internal RF, battery and other components from interference, ensuring the purity of the image signal. Interference, to ensure the purity of the image signal, reduce imaging noise.

Two-layer synergy significantly reduces the risk of signal crosstalk, especially suitable for high-end cell phone camera scenes that support “HD imaging + real-time preview” dual-function.

Thickness: only 0.12mm of the ultimate thin and light characteristics, perfectly suited to the smartphone “thin” design trend (such as body thickness <8mm). In the structure of the cell phone's internal space, it can significantly reduce the space occupied by the wires around the camera module, freeing up space for core components such as larger sensors and optical lenses, and at the same time reducing the difficulty of bending the wires during the assembly process (supporting a minimum bending radius of R=0.5mm), improving production efficiency.

Surface treatment: the use of immersion gold process, through the uniform deposition of nickel-gold plating on the surface of the copper layer, bringing multiple advantages:

excellent conductivity of the gold layer, reducing high-frequency image signal transmission loss, to ensure the color reproduction and dynamic range of the screen;

to enhance the corrosion and abrasion resistance of the line to adapt to long-term use of cell phones in the daily wear and tear, temperature and humidity changes (such as high temperature in the summer, rainy season and humidity), and other environmental factors;

to enhance the reliability of the soldering joints Enhance the reliability of the soldering points to ensure stable contact between the wires and the camera sensor and motherboard, reducing problems such as “blurred photos and poor focusing” caused by poor contact.

Capel Flexible PCB & Rigid-Flex PCB Process  Capability

2 Layer Flexible PCB Boards Stackup

4 Layer Rigid-Flex PCB Stackup

8 layer HDI PCBs

Microscope Testing

AOI Inspection

2D Testing

Impedance Testing

RoHS Testing

Flying Probe

Horizontal Tester

Bending Teste

Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.