Type: Flexible Printed Circuit (FPC) for solar cells, designed for solar power generation systems, with excellent flexible bending and environmental resistance. Whether it is the connection of components in distributed photovoltaic power plants, the internal circuitry of portable solar chargers, or the solar power supply equipment in the aerospace field, it can be flexibly adapted to complex installation scenarios (e.g., curved photovoltaic panels, foldable solar modules), realizing efficient transmission of DC power generated by solar cells, replacing the traditional rigid conductors, and enhancing the integration and reliability of power generation systems. 

Minimum line width / line spacing: 0.07mm/0.06mm high precision standard. This parameter is optimized for the low-voltage, high-current transmission characteristics of solar cells: 0.07mm line width maximizes current-carrying capacity in a limited space and reduces line resistance loss (measured resistance ≤ 0.05Ω/m); 0.06mm line spacing realizes high-density wiring, supports parallel/series connection of multiple solar cells, and adapts to the needs of high-power power generation systems to ensure the maximum efficiency of power generation. 

Layers: 2-layer structure design, through scientific layering to realize the precise division of circuit functions:

Power layer: undertake the main current transmission task, using a wide alignment design, to adapt to the output current characteristics of the solar cell (support the maximum sustained current ≥ 5A);

Signal layer: integrated Signal layer: integrating voltage monitoring, temperature sensing and other auxiliary signal lines, real-time feedback of the working status of the battery cell, providing data support for the intelligent regulation of the system. The synergy of the two layers not only guarantees the stability of power transmission, but also realizes the precise monitoring of equipment status, which is especially suitable for intelligent PV system scenarios.

Thickness: 0.15mm thin and light, which is perfectly suited to the lightweight and integration needs of solar equipment. In flexible photovoltaic modules (such as bendable solar panels), it can significantly reduce the impact of circuit components on the flexibility of the battery cell and support ≥3000 bending cycles (bending radius R=50mm); in portable solar equipment, it can reduce the overall thickness and weight and enhance the portability of the product.

Surface treatment: the use of immersion gold 2 micro-inch process (nickel thickness ≥5μm, gold thickness ≥5μm). 5μm, gold layer thickness ≥ 0.05μm), bringing multiple weathering advantages:

excellent conductivity of the gold layer, reducing contact resistance (contact resistance ≤ 10mΩ), reducing power transmission loss;

2 micro-inch thickened gold layer significantly improves corrosion resistance, can withstand outdoor high temperatures, high humidity, ultraviolet irradiation and other harsh environments (through the 1000-hour salt spray test without rust). 1000 hours of salt spray test without corrosion);

to enhance the reliability of the solder joints, to ensure that the FPC and solar cell, terminal connection parts in the long-term thermal cycle (-40 ° C ~ +85 ° C) does not fall off, do not oxidize, to extend the service life of the equipment. 

Capel Flexible PCB & Rigid-Flex PCB Process  Capability

2 Layer Flexible PCB Boards Stackup

4 Layer Rigid-Flex PCB Stackup

8 layer HDI PCBs

Microscope Testing

AOI Inspection

2D Testing

Impedance Testing

RoHS Testing

Flying Probe

Horizontal Tester

Bending Teste

Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.