Capel’s Dual-Layer Flexible PCB for Communication Products is a core circuit component tailored for various communication devices (such as wireless routers, two-way radios, base station modules, and IoT communication terminals). It features an ultra-thin flexible design and efficient signal transmission capability to meet the core demands of communication products—miniaturization, high performance, and high reliability. Adopting a 2-layer double-sided board structure with a precisely controlled thickness of 0.1mm, it combines extreme thinness with excellent flexibility, enabling flexible adaptation to the compact layout of motherboards, antenna modules, and interface components inside communication devices. It can even fit curved surfaces or narrow installation spaces without occupying redundant volume, meeting the lightweight design requirements of equipment. Meanwhile, it withstands slight bending and vibration during device assembly and daily use, reducing the risk of circuit damage.
In terms of signal transmission and reliability, the dual-layer structure enables high-density wiring, allowing reasonable partitioning of power supply, signal, and grounding paths. This significantly minimizes signal crosstalk and electromagnetic interference, providing a stable channel for high-frequency signal transmission (such as 5G, Wi-Fi 6, and Bluetooth) in communication devices. Equipped with 2 microinches (approximately 0.0508μm) immersion gold surface finish, the uniform and dense gold layer offers excellent oxidation resistance, wear resistance, and contact stability. It effectively reduces contact resistance, prevents signal attenuation or interruption, and ensures smooth and stable communication links—maintaining superior performance even in long-term continuous operation scenarios. The product uses high-quality flexible substrates with good temperature resistance and mechanical strength, adapting to the usage needs of communication devices in different environments and extending the overall service life of the equipment.
As a professional PCB solution provider, Capel offers comprehensive customization capabilities: personalized development of 1-30 layer FPC flexible PCBs, 2-32 layer rigid-flex circuit boards, and 1-60 layer rigid PCBs. Complemented by reliable rapid-turnaround PCB prototyping and fast SMT PCB assembly services, we help communication device clients accelerate R&D cycles and improve mass production efficiency. Our services span diverse industries, including medical devices, IoT, TUT, drones, aviation, automotive, telecommunications, consumer electronics, military, aerospace, industrial control, artificial intelligence, electric vehicles, and more. With stable product quality, flexible customization solutions, and efficient delivery capabilities, we have become a trusted partner for customers across various sectors.
If you have customization needs for communication product PCBs or other field-related PCBs, please click the button below to send us an email. Capel will provide you with a tailored solution.
Capel Flexible PCB & Rigid-Flex PCB Process Capability
| Category | Process Capability | Category | Process Capability |
| Production Type | Single layer FPC / Double layers FPC Multi-layer FPC / Aluminum PCBs Rigid-Flex PCB | Layers Number | 1-30 layers FPC 2-32 layers Rigid-FlexPCB 1-60 layers Rigid PCB HDI Boards |
| Max Manufacture Size | Single layer FPC 4000mm Double layers FPC 1200mm Multi-layers FPC 750mm Rigid-Flex PCB 750mm | Insulating Layer Thickness | 27.5um /37.5/ 50um /65/ 75um / 100um / 125um / 150um |
| Board Thickness | FPC 0.06mm - 0.4mm Rigid-Flex PCB 0.25 - 6.0mm | Tolerance of PTH Size | ±0.075mm |
| Surface Finish | Immersion Gold/Immersion Silver/Gold Plating/Tin Plating/OSP | Stiffener | FR4 / PI / PET / SUS / PSA/Alu |
| Semicircle Orifice Size | Min 0.4mm | Min Line Space/ width | 0.045mm/0.045mm |
| Thickness Tolerance | ±0.03mm | Impedance | 50Ω-120Ω |
| Copper Foil Thickness | 9um/12um / 18um / 35um / 70um/100um | Impedance Controlled Tolerance | ±10% |
Tolerance of NPTH Size | ±0.05mm | The Min Flush Width | 0.80mm |
| Min Via Hole | 0.1mm | Implement Standard | GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III |
Capel manufactures customized high-precision Rigid Flexible Circuit Board / Flexible PCB / HDI PCB with 15 years of experience with our professionalism
2 Layer Flexible PCB Boards Stackup
4 Layer Rigid-Flex PCB Stackup
Testing And Inspection Equipment
Capel provide customers customized PCB Service with 15 years of experience
Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.
