Communication Products Dual-Layer Flexible PCB
Communication Products Dual-Layer Flexible PCB
  • Communication Products Dual-Layer Flexible PCB
  • Communication Products Dual-Layer Flexible PCB
  • Communication Products Dual-Layer Flexible PCB
  • Communication Products Dual-Layer Flexible PCB
  • Communication Products Dual-Layer Flexible PCB
  • Communication Products Dual-Layer Flexible PCB

Brief Introduction:

Type: Double-sided board

Surface Finish: Immersion gold 2 mil

Number of Layers: 2 layers

Board Thickness: 0.1mm

Capel Services:

Supports customization of 1-30 layer FPC flexible PCBs, 2-32 layer rigid-flex circuit boards, 1-60 layer rigid PCBs, reliable rapid turnaround PCB prototyping, and fast SMT PCB assembly

Industries We Serve:

Medical devices, IoT, TUT, drones, aviation, automotive, telecommunications, consumer electronics, military, aerospace, industrial control, artificial intelligence, electric vehicles, and more...

If you have related needs, please click the button below to send us an email.

Capel’s Dual-Layer Flexible PCB for Communication Products is a core circuit component tailored for various communication devices (such as wireless routers, two-way radios, base station modules, and IoT communication terminals). It features an ultra-thin flexible design and efficient signal transmission capability to meet the core demands of communication products—miniaturization, high performance, and high reliability. Adopting a 2-layer double-sided board structure with a precisely controlled thickness of 0.1mm, it combines extreme thinness with excellent flexibility, enabling flexible adaptation to the compact layout of motherboards, antenna modules, and interface components inside communication devices. It can even fit curved surfaces or narrow installation spaces without occupying redundant volume, meeting the lightweight design requirements of equipment. Meanwhile, it withstands slight bending and vibration during device assembly and daily use, reducing the risk of circuit damage.

In terms of signal transmission and reliability, the dual-layer structure enables high-density wiring, allowing reasonable partitioning of power supply, signal, and grounding paths. This significantly minimizes signal crosstalk and electromagnetic interference, providing a stable channel for high-frequency signal transmission (such as 5G, Wi-Fi 6, and Bluetooth) in communication devices. Equipped with 2 microinches (approximately 0.0508μm) immersion gold surface finish, the uniform and dense gold layer offers excellent oxidation resistance, wear resistance, and contact stability. It effectively reduces contact resistance, prevents signal attenuation or interruption, and ensures smooth and stable communication links—maintaining superior performance even in long-term continuous operation scenarios. The product uses high-quality flexible substrates with good temperature resistance and mechanical strength, adapting to the usage needs of communication devices in different environments and extending the overall service life of the equipment.

As a professional PCB solution provider, Capel offers comprehensive customization capabilities: personalized development of 1-30 layer FPC flexible PCBs, 2-32 layer rigid-flex circuit boards, and 1-60 layer rigid PCBs. Complemented by reliable rapid-turnaround PCB prototyping and fast SMT PCB assembly services, we help communication device clients accelerate R&D cycles and improve mass production efficiency. Our services span diverse industries, including medical devices, IoT, TUT, drones, aviation, automotive, telecommunications, consumer electronics, military, aerospace, industrial control, artificial intelligence, electric vehicles, and more. With stable product quality, flexible customization solutions, and efficient delivery capabilities, we have become a trusted partner for customers across various sectors.

If you have customization needs for communication product PCBs or other field-related PCBs, please click the button below to send us an email. Capel will provide you with a tailored solution.

Capel Flexible PCB & Rigid-Flex PCB Process  Capability
CategoryProcess CapabilityCategoryProcess Capability
Production TypeSingle layer FPC / Double layers FPC
Multi-layer FPC / Aluminum PCBs
Rigid-Flex PCB
Layers Number1-30 layers FPC
2-32 layers Rigid-FlexPCB
1-60 layers Rigid PCB
HDI Boards
Max Manufacture SizeSingle layer FPC 4000mm
Double layers FPC 1200mm
Multi-layers FPC 750mm
Rigid-Flex PCB 750mm
Insulating Layer
Thickness
27.5um /37.5/ 50um /65/ 75um / 100um /
125um / 150um
Board ThicknessFPC 0.06mm - 0.4mm
Rigid-Flex PCB 0.25 - 6.0mm
Tolerance of PTH
Size
±0.075mm
Surface FinishImmersion Gold/Immersion
Silver/Gold Plating/Tin Plating/OSP
StiffenerFR4 / PI / PET / SUS / PSA/Alu
Semicircle Orifice SizeMin 0.4mmMin Line Space/ width0.045mm/0.045mm
Thickness Tolerance±0.03mmImpedance50Ω-120Ω
Copper Foil Thickness9um/12um / 18um / 35um / 70um/100umImpedance
Controlled
Tolerance
±10%
Tolerance of NPTH
Size
±0.05mmThe Min Flush Width0.80mm
Min Via Hole0.1mmImplement
Standard
GB / IPC-650 / IPC-6012 / IPC-6013II /
IPC-6013III
Capel manufactures customized high-precision Rigid Flexible Circuit Board / Flexible PCB / HDI PCB with 15 years of experience with our professionalism
2 Layer Flexible PCB Boards Stackup
4 Layer Rigid-Flex PCB Stackup
8 layer HDI PCBs
Testing And Inspection Equipment
Microscope Testing
AOI Inspection
2D Testing
Impedance Testing
RoHS Testing
Flying Probe
Horizontal Tester
Bending Teste
Capel provide customers customized PCB Service with 15 years of experience
Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.
Related products

Capel manufacturing PCBs since 2009. Professional technology and high-precision Printed Circuit Boards involved in Medical, IOT, UAV, Aviation, Automotive, Aerospace, Industrial Control, Artificial Intelligence, Consumer Electronics etc..

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CONTACT US

    Shenzhen Capel Technology Co., Ltd. +86 13670210335 sales06@kbefpc.com +86 13670210335 +86 13670210335

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