Type: Flexible Circuit Boards (FPC) for game consoles, designed for high-frequency operation and complex signal transmission of gaming devices, adapting to core scenarios such as joystick buttons, joystick control, somatosensory feedback, screen display and so on. Whether it's a multi-key signal link for console grips (e.g. PS, Xbox grips), a folding screen connection for handhelds (e.g. Switch), or a sensor signal transmission for somatosensory controllers, FPCs can be flexibly adapted to the compact layout of the device (e.g. curved surface structure of the grip area of the grips, curved part of the folding axle of the handhelds) and can realize the parallel transmission of multiple types of signals, such as key commands, joystick displacements, vibration feedback, etc., and can be an alternative to traditional rigid wiring, thus improving operation response. It realizes parallel transmission of multiple types of signals, such as key commands, joystick displacement, vibration feedback, etc., replacing the traditional rigid wiring and improving the response speed and durability of the equipment.

Minimum line width/spacing: 0.076mm/0.076mm symmetrical high-precision standard. This parameter is optimized for the characteristics of high-frequency operation signals of game machines: 0.076mm line width ensures millisecond key signals (response time ≤ 10ms), lower transmission loss (signal attenuation rate ≤ 0.1dB/m), and reduced operating delays; 0.076mm symmetrical line spacing realizes dense cabling in the limited space of rows of wires (a single row of wires supports ≥ 20 independent signals), and supports multiple buttons (e.g., ABXY keys), joysticks (X/Y), and other signals (e.g., X/Y). Keys), joystick (X / Y axis displacement), vibration motor signal parallel transmission, to avoid signal crosstalk caused by “misoperation, command loss” (crosstalk suppression ratio ≥ 75dB), to protect the precise operation of the competitive games (such as fighting games, combo input).

Layers: 2-layer structure design, through scientific layering to achieve precise isolation of functions, to solve the interference problem of complex signals:

Signal layer: short-circuit path direct connection design, optimize the high-frequency signal transmission path of the keys and joysticks, to adapt to the high response requirements of gaming equipment (delay from key triggering to on-screen feedback ≤ 20ms);

Grounding layer: a large-area copper foil cover to form an electromagnetic shielding barrier, effectively isolate the internal motors of the equipment (e.g. vibration motor), wireless modules (e.g. vibration motor), wireless module (≥ 75dB). Ground layer: a large area of copper foil cover to form an electromagnetic shielding barrier, effectively isolate the device's internal motors (such as vibration motors), wireless modules (such as Bluetooth) electromagnetic interference (EMI suppression ≥ 65dB), especially suitable for wireless grips strong electromagnetic environment, to avoid interference caused by the operation of the lag.

The two-layer synergy ensures high-speed signal transmission while balancing flexibility and structural strength, adapting to the slight deformation scenarios when the handle is gripped.

Thickness: The optimized thickness of 0.25mm perfectly suits the dual demands of “operational reliability” and “structural strength” of game consoles. In the console handle, it can improve the tensile performance of the cable (tensile strength ≥50N/cm), avoiding the breakage of the cable caused by frequent gripping and dropping; in the folding axis of the handheld, it can maintain moderate flexibility (supporting the minimum bending radius of R=2mm), adapting to more than 100,000 times of folding operations (such as opening and closing of Switch handhelds), and at the same time, reducing the fatigue of bending.

Surface treatment: Gold-plated (gold layer thickness ≥ 0.1μm), bringing multiple gaming device-specific advantages:

Gold layer has excellent electrical conductivity, contact resistance ≤ 5mΩ, which reduces the loss of key signal transmission and ensures rapid and continuous operation (such as the continuous firing buttons of shooter games) with no latency;

Gold-plated layer has strong abrasion resistance, which can withstand more than a million times of key pressing and friction (no abrasion after passing 1 million times of insertion and removal test), adapting to heavy gamers' high-frequency operations (such as opening and closing of Switch handheld). Adapt to the high-frequency use scenarios of heavy gamers;

enhance the reliability of the soldering joints, to ensure that the row of wires and key contacts, the vibration motor of the welded parts of the long-term vibration (such as the joystick vibration feedback) without loosening, to extend the service life of the device (design life of ≥ 30,000 hours of game time).

Capel Flexible PCB & Rigid-Flex PCB Process  Capability

2 Layer Flexible PCB Boards Stackup

4 Layer Rigid-Flex PCB Stackup

8 layer HDI PCBs

Microscope Testing

AOI Inspection

2D Testing

Impedance Testing

RoHS Testing

Flying Probe

Horizontal Tester

Bending Teste

Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.