Type: Projector-specific flexible circuit boards (FPC), designed for complex connections within the projection equipment, adapted to the core scenarios of optical signal transmission, lens focus control, touch command interaction. Whether it is a home smart projector (body thickness ≤ 5cm), portable pocket projector (weight ≤ 300g), or engineering projector (high brightness telephoto lens), it can flexibly adapt to the compact internal layout (such as millimeter gap between the optical unit and the motherboard, and the curved part of the rotatable lens) to realize the stable transmission of high-definition image signals (HDMI 2.0, MIPI), lens motor control signals and power supply, replacing the traditional rigid wiring. It replaces the traditional rigid wiring and enhances the integration and operational flexibility of the equipment.

Minimum line width/spacing: 0.10mm/0.10mm symmetrical high-precision standard. This parameter is optimized for projector high-frequency image signal characteristics: 0.10mm line width to ensure that the 4K/60Hz HD signal (transmission rate ≥ 18Gbps) lower transmission loss (signal attenuation rate of ≤ 0.2dB / m), reducing the loss of picture quality details; 0.10mm symmetrical line spacing in the limited space to achieve a dense cabling, support for the image signal, the lens focusing signals, temperature detection signals, parallel transmission (single row of wires). Parallel transmission of image signals, lens focusing signals, temperature detection signals (single row of lines to support ≥ 16 independent signals), to avoid signal crosstalk caused by picture noise, focusing delays (crosstalk suppression ratio of ≥ 70dB), to ensure that the edges of the projection screen is clear and blur-free.

Layers: 2-layer structure design, through scientific layering to achieve precise isolation of functions, to solve the interference problem of complex signals:

Signal layer: differential routing and equal-length wiring design, optimize the high-definition image signal paths, adapted to HDMI 2.0, DisplayPort and other high-speed protocols, to ensure that the picture is not dragging (dynamic response delay of ≤ 10ms);

Ground layer: large-area copper foil covering the formation of electromagnetic Ground layer: a large area of copper foil cover to form an electromagnetic shielding barrier, effectively isolate the optical machine, cooling fan electromagnetic interference (EMI suppression ≥ 60dB), especially suitable for high temperature inside the projector, strong electromagnetic environment, to avoid the noise affecting the picture quality (signal-to-noise ratio ≥ 55dB).

Two-layer synergy in the protection of high-definition signal transmission at the same time, simplify the circuit structure, to adapt to the lightweight needs of the projection equipment.

Thickness: 0.15mm thin and light, perfectly suited to the projector “miniaturization” design trend. In portable projection (e.g. pocket projection), it can reduce the occupation of internal space by the wiring (releasing ≥8% of space), and reserve a place for a larger-capacity battery or a higher-brightness light source; in the rotatable lens module, it can improve the flexibility of bending (supporting the minimum bend radius R=1mm), adapt to the dynamic scene of ±30° manual focusing of the lens or automatic keystone correction, and avoid fatigue and breakage of the wiring due to frequent rotation. Surface Finish: Gold-plated 2-micron gold

Surface treatment: the use of immersed gold 2 micro-inch process (nickel layer thickness ≥ 5μm, gold layer thickness ≥ 0.05μm), bringing multiple durability advantages:

excellent conductivity of the gold layer, the contact resistance ≤ 8mΩ, to reduce the loss of high-definition signal transmission, to ensure that the 4K picture quality reproduction (color deviation ≤ 3 ΔE);

2 micro-inch thickened layer of gold temperature resistance is strong, can be subject to high temperature projector working environment (temperature near the optical machine ≤ 80 ℃), through 1000 years of projector work, the temperature of the optical machine ≤ 80 ℃, to ensure the quality of the image. ≤ 80 ℃), through 1000 hours of high-temperature aging test without performance degradation;

to enhance the reliability of the soldering joints to ensure that the row of wires and the lens motor, the optical interface of the welded parts of the lens motor, in the long-term vibration (such as portable projection movement) without loosening, to extend the service life of the equipment (design life ≥ 10,000 hours of projection time).

Capel Flexible PCB & Rigid-Flex PCB Process  Capability

2 Layer Flexible PCB Boards Stackup

4 Layer Rigid-Flex PCB Stackup

8 layer HDI PCBs

Microscope Testing

AOI Inspection

2D Testing

Impedance Testing

RoHS Testing

Flying Probe

Horizontal Tester

Bending Teste

Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.