Tablet Antenna FPC
Tablet Antenna FPC
  • Tablet Antenna FPC
  • Tablet Antenna FPC

Tablet Antenna FPC

A short introduction:

Type: Tablet Antenna FPC

Minimum Line Width/Line Spacing: 0.08mm/0.075mm

Number of Layers: 2 Layers

Thickness: 0.2mm

Surface Finish: Immersion Gold 1 micro inch

Capel's Services:

Support Customized 1-30 Layer FPC Flexible PCB, 2-32 Layer Rigid-Flexible Circuit Boards, 1-60 Layer Rigid PCB, Reliable Fast Turnaround PCB prototyping, rapid SMT PCB assembly

Industries we serve:

Medical devices, IoT, TUT, drones, aerospace, automotive, telecom, consumer electronics, military, aerospace, industrial control, AI, electric vehicles, etc. ......

If you have related needs, please feel free to send us an email by clicking the button below.

Type: Tablet PC special antenna flexible circuit board (FPC), designed for wireless communication scenarios, adapted to Wi-Fi, 5G, Bluetooth, NFC and other multi-frequency band signal transceiver. Whether it is a 10.9-inch thin and light tablet (body thickness ≤ 6.8mm), folding screen tablet bezel area, or outdoor tablets supporting cellular networks, can be flexibly adapted to the curved bezel of the device, the back of the notch and other alien structures, instead of the traditional metal shrapnel antenna in a limited space (installation area of ≤ 10cm ²) to achieve full coverage of multi-frequency signals to meet the wireless needs of video conferencing, online games, outdoor navigation, and other scenes. It realizes full multi-band signal coverage in limited space (installation area ≤10cm²) and meets the wireless needs of video conference, online game, outdoor navigation, etc.


Minimum line width / line spacing: 0.08mm/0.075mm high precision standard. This parameter is optimized for the characteristics of high-frequency wireless signals: 0.08mm line width ensures lower 2.4GHz/5GHz signal transmission loss (attenuation rate ≤0.3dB@5GHz), which reduces signal attenuation when communicating through a wall or over long distances; 0.075mm line spacing realizes multiband antenna integration in a limited wiring space (a single FPC can integrate a Wi-Fi+Bluetooth dual band antenna), and isolates different bands through reasonable spacing. The FPC is designed to isolate different frequency band signals through reasonable spacing (band isolation degree ≥ 30dB), avoiding “network stuttering and disconnection” caused by mutual interference between 2.4GHz and 5GHz signals.


Layers: 2-layer structure design, through scientific layering to achieve “signal + ground” synergistic efficiency:

antenna radiation layer: copper foil etching to form a specific pattern (such as inverted F-shape, monopole structure), accurately matching the target band (2.4GHz band resonance frequency deviation of ≤ ± 5%), to ensure that the signal transmitting and receiving efficiency (gain of ≥ 2dBi @ 5GHz). ≥

Grounding reference layer: large area copper foil covers to form a “ground plane”, which not only serves as the reflective surface of the antenna to enhance the radiation efficiency (15% higher than the single-layer design), but also shields the flat panel from the internal screen and the electromagnetic interference of the battery (EMI suppression ≥ 55dB), which is especially suitable for strong electromagnetic environments of the flat panels with a full-metal body. Electromagnetic environment.

Two-layer synergy in reducing the size of the antenna at the same time, improve the stability of multi-band signal and anti-interference ability.


Thickness: 0.2mm ultra-thin, perfectly suited to the “zero waste of space” design requirements of flat panels. In the bezel area (width ≤ 8mm), it can closely fit the curved surface (curvature ≥ R5mm), without increasing the thickness of the device; when installed in the groove on the back, it can be slightly deformed with the equipment shell (tensile rate ≤ 5%), avoiding the antenna performance degradation due to the assembly stress, and at the same time, reserving more space for the battery and camera module.


Surface treatment: the use of immersed gold 1 micro-inch process (nickel layer thickness ≥ 3μm, gold layer thickness ≥ 0.025μm), to bring multiple high-frequency advantages:

excellent conductivity of the gold layer, reduce the antenna surface impedance (impedance deviation ≤ 5%), to ensure that the radiation efficiency of the high-frequency signals of the 5GHz (efficiency ≥ 60%), to enhance the stability of the peak rate of the Wi-Fi 6 of 1.2Gbps;

immersed gold plating layer of corrosion resistance, can withstand sweat inside the tablet Strong corrosion resistance of the immersed gold plating layer, which can resist the erosion of sweat and dust inside the flat panel (no rust and corrosion after 48 hours of neutral salt spray test), avoiding the “signal weakness and frequency band shift” caused by the oxidation of the copper foil after long-term use;

enhances the reliability of the soldering of the antenna and the RF module to ensure that the soldering points of the antenna and the RF interface of the motherboard are stable (contact resistance ≤ 10m m) in the contact of long-term vibration (e.g., bumps when carrying). Stable (contact resistance ≤ 10mΩ), prolonging the life of wireless function (design life ≥ 3 years).


Capel Flexible PCB & Rigid-Flex PCB Process  Capability

CategoryProcess CapabilityCategoryProcess Capability
Production TypeSingle layer FPC / Double layers FPC
Multi-layer FPC / Aluminum PCBs
Rigid-Flex PCB
Layers Number1-30 layers FPC
2-32 layers Rigid-FlexPCB
1-60 layers Rigid PCB
HDI Boards
Max Manufacture SizeSingle layer FPC 4000mm
Double layers FPC 1200mm
Multi-layers FPC 750mm
Rigid-Flex PCB 750mm
Insulating Layer
Thickness
27.5um /37.5/ 50um /65/ 75um / 100um /
125um / 150um
Board ThicknessFPC 0.06mm - 0.4mm
Rigid-Flex PCB 0.25 - 6.0mm
Tolerance of PTH
Size
±0.075mm
Surface FinishImmersion Gold/Immersion
Silver/Gold Plating/Tin Plating/OSP
StiffenerFR4 / PI / PET / SUS / PSA/Alu
Semicircle Orifice SizeMin 0.4mmMin Line Space/ width0.045mm/0.045mm
Thickness Tolerance±0.03mmImpedance50Ω-120Ω
Copper Foil Thickness9um/12um / 18um / 35um / 70um/100umImpedance
Controlled
Tolerance
±10%
Tolerance of NPTH
Size
±0.05mmThe Min Flush Width0.80mm
Min Via Hole0.1mmImplement
Standard
GB / IPC-650 / IPC-6012 / IPC-6013II /
IPC-6013III
Capel manufactures customized high-precision Rigid Flexible Circuit Board / Flexible PCB / HDI PCB with 15 years of experience with our professionalism
2 Layer Flexible PCB Boards Stackup
4 Layer Rigid-Flex PCB Stackup
8 layer HDI PCBs
Testing And Inspection Equipment
Microscope Testing
AOI Inspection
2D Testing
Impedance Testing
RoHS Testing
Flying Probe
Horizontal Tester
Bending Teste
Capel provide customers customized PCB Service with 15 years of experience
Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.


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Capel manufacturing PCBs since 2009. Professional technology and high-precision Printed Circuit Boards involved in Medical, IOT, UAV, Aviation, Automotive, Aerospace, Industrial Control, Artificial Intelligence, Consumer Electronics etc..

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    Shenzhen Capel Technology Co., Ltd. +86 13670210335 sales06@kbefpc.com +86 13670210335 +86 13670210335

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