Capel’s high-density 4-layer multilayer PCB is a core circuit component tailored for precision electronic devices requiring strict circuit integration and signal transmission efficiency. It achieves a perfect balance of high performance, miniaturization, and reliability through an optimized layered structure and premium craftsmanship, covering diverse high-end application scenarios. Adopting a 4-layer design with a precisely controlled board thickness of 0.15mm, it combines ultra-thinness and lightweight with structural stability, enabling flexible integration into products with compact internal spaces such as mobile phones, drones, and smart wearables. It fits complex wiring needs without adding extra volume or weight to the device, meeting the mainstream design trend of electronic device integration and lightweight—especially suitable for complex circuit systems requiring parallel transmission of multi-channel signals.
Equipped with 2 microinches (approximately 0.0508μm) immersion gold surface finish, the uniform and dense gold layer offers excellent oxidation resistance, wear resistance, and contact stability. It effectively reduces contact resistance to ensure the fluency and accuracy of high-frequency signal transmission, avoiding signal attenuation caused by environmental erosion or plug-and-play operations during long-term use. The 4-layer high-density wiring structure enables reasonable partition layout of power supply, signals, and grounding, significantly reducing signal interference and crosstalk, providing stable circuit support for complex functional modules (such as sensors, processors, and communication modules) to ensure the efficient performance of the entire device.
As a professional PCB solution provider, Capel offers comprehensive customization capabilities: personalized development of 1-30 layer FPC flexible PCBs, 2-32 layer rigid-flex PCBs, and 1-60 layer rigid PCBs, complemented by reliable rapid-turnaround PCB prototyping and fast SMT PCB assembly services to help customers shorten R&D cycles and accelerate product mass production. Our services span multiple industries, including medical devices, IoT, TUT, drones, aviation, automotive, telecommunications, consumer electronics, military, aerospace, industrial control, artificial intelligence, electric vehicles, and more. With stable product quality, flexible customization solutions, and efficient delivery capabilities, we have become a trusted partner for customers across various sectors.
If you have related PCB customization needs, please click the button below to send us an email. Capel will provide you with a tailored solution.
Capel Flexible PCB & Rigid-Flex PCB Process Capability| Category | Process Capability | Category | Process Capability |
| Production Type | Single layer FPC / Double layers FPC
Multi-layer FPC / Aluminum PCBs
Rigid-Flex PCB | Layers Number | 1-30 layers FPC
2-32 layers Rigid-FlexPCB
1-60 layers Rigid PCB
HDI Boards |
| Max Manufacture Size | Single layer FPC 4000mm
Double layers FPC 1200mm
Multi-layers FPC 750mm
Rigid-Flex PCB 750mm | Insulating Layer
Thickness | 27.5um /37.5/ 50um /65/ 75um / 100um /
125um / 150um |
| Board Thickness | FPC 0.06mm - 0.4mm
Rigid-Flex PCB 0.25 - 6.0mm | Tolerance of PTH
Size | ±0.075mm |
| Surface Finish | Immersion Gold/Immersion
Silver/Gold Plating/Tin Plating/OSP | Stiffener | FR4 / PI / PET / SUS / PSA/Alu |
| Semicircle Orifice Size | Min 0.4mm | Min Line Space/ width | 0.045mm/0.045mm |
| Thickness Tolerance | ±0.03mm | Impedance | 50Ω-120Ω |
| Copper Foil Thickness | 9um/12um / 18um / 35um / 70um/100um | Impedance
Controlled
Tolerance | ±10% |
Tolerance of NPTH
Size | ±0.05mm | The Min Flush Width | 0.80mm |
| Min Via Hole | 0.1mm | Implement
Standard | GB / IPC-650 / IPC-6012 / IPC-6013II /
IPC-6013III |
Capel manufactures customized high-precision Rigid Flexible Circuit Board / Flexible PCB / HDI PCB with 15 years of experience with our professionalism
2 Layer Flexible PCB Boards Stackup
4 Layer Rigid-Flex PCB Stackup
Testing And Inspection Equipment
Capel provide customers customized PCB Service with 15 years of experience
Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.
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+86 13670210335
+86 13670210335
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