Kaboer’s Four-Layer Flexible PCB for Smart VR Glasses is a high-density core circuit component tailored for immersive virtual reality devices, precisely meeting the core design demands of VR glasses—lightweight, high integration, and low latency. Adopting a 4-layer multilayer board structure with a precisely controlled thickness of 0.18mm, it achieves high-density circuit integration while retaining excellent flexibility and thinness. It can flexibly fit the curved structures, micro-display modules, sensor arrays, and wireless communication modules inside VR headsets, adding no extra weight or volume to the device while withstanding slight bending and vibration during daily use, aligning with the compact and portable development trend of VR equipment.
In terms of technical parameters and performance guarantees, the product offers three key advantages: ① Ultra-Fine Precision Wiring: Supporting high-density layout with 0.08mm trace width and 0.075mm spacing, it can integrate multiple circuits required for VR glasses (such as display driving, attitude sensing, and Bluetooth/Wi-Fi communication) in a limited space, enabling parallel transmission of multi-module signals and meeting the strict requirements of VR devices for circuit integration; ② Optimized Copper Thickness: The 25μm copper thickness substrate balances good conductivity and flexible adaptability, ensuring low-loss transmission of high-frequency signals (such as high-definition image data and real-time attitude signals) to avoid picture delay or stuttering, while not affecting the PCB’s bending performance, perfectly fitting the complex wiring paths inside VR glasses; ③ Immersion Gold Surface Finish: The full-board immersion gold process creates a uniform and dense gold layer, providing superior oxidation resistance, low contact resistance, and wear resistance. It enhances contact stability with micro-connectors and sensor pins, ensuring accurate and smooth signal transmission during long-term use, while improving the PCB’s environmental adaptability. The 4-layer structure also enables reasonable partitioning of power supply, signals, and grounding, effectively reducing electromagnetic interference and providing stable circuit support for the immersive experience of VR devices.
As a professional PCB solution provider, Kaboer offers comprehensive customization capabilities: personalized development of 1-30 layer FPC flexible PCBs, 2-32 layer rigid-flex PCBs, and 1-60 layer rigid PCBs. Complemented by reliable rapid-turnaround PCB prototyping and fast SMT PCB assembly services, we help VR device clients accelerate product R&D and mass production processes. Our services span diverse industries, including medical devices, IoT, TUT, drones, aviation, automotive, telecommunications, consumer electronics, military, aerospace, industrial control, artificial intelligence, electric vehicles, and more. With stable product quality, flexible customization solutions, and efficient delivery capabilities, we have become a trusted partner for customers across various sectors.
If you have customization needs for smart VR glass PCBs or other consumer electronic device PCBs, please click the button below to send us an email. Kaboer will provide you with a tailored solution.
Capel Flexible PCB & Rigid-Flex PCB Process Capability
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Category
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Process Capability
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Category
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Process Capability
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Production Type
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Single layer FPC / Double layers FPC Multi-layer FPC / Aluminum PCBs Rigid-Flex PCB
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Layers Number
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1-30 layers FPC 2-32 layers Rigid-FlexPCB 1-60 layers Rigid PCB HDI Boards
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Max Manufacture Size
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Single layer FPC 4000mm Double layers FPC 1200mm Multi-layers FPC 750mm Rigid-Flex PCB 750mm
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Insulating Layer Thickness
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27.5um /37.5/ 50um /65/ 75um / 100um / 125um / 150um
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Board Thickness
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FPC 0.06mm - 0.4mm Rigid-Flex PCB 0.25 - 6.0mm
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Tolerance of PTH Size
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±0.075mm
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Surface Finish
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Immersion Gold/Immersion Silver/Gold Plating/Tin Plating/OSP
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Stiffener
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FR4 / PI / PET / SUS / PSA/Alu
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Semicircle Orifice Size
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Min 0.4mm
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Min Line Space/ width
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0.045mm/0.045mm
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Thickness Tolerance
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±0.03mm
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Impedance
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50Ω-120Ω
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Copper Foil Thickness
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9um/12um / 18um / 35um / 70um/100um
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Impedance Controlled Tolerance
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±10%
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Tolerance of NPTH Size
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±0.05mm
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The Min Flush Width
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0.80mm
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Min Via Hole
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0.1mm
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Implement Standard
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GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III
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Capel manufactures customized high-precision Rigid Flexible Circuit Board / Flexible PCB / HDI PCB with 15 years of experience with our professionalism
2 Layer Flexible PCB Boards Stackup
4 Layer Rigid-Flex PCB Stackup
Testing And Inspection Equipment
Capel provide customers customized PCB Service with 15 years of experience
Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.