3-Layer Multilayer PCB: High-Density 0.15mm Ultra-Thin Circuit Boards for Compact Electronics-Pcb Manufacturer, Rigid Flex Pcb, Flexible Pcb

Three-Layer Test Board

Brief Introduction:

Type: Multilayer Board

Surface Finish: Immersion Gold 2μm

Number of Layers: 3 Layers

Board Thickness: 0.15mm

Capel Services:

Supports customization of 1-30 layer FPC flexible PCBs, 2-32 layer rigid-flex PCBs, 1-60 layer rigid PCBs, reliable rapid turnaround PCB prototyping, and fast SMT PCB assembly

Industries We Serve:

Medical devices, IoT, TUT, drones, aviation, automotive, telecommunications, consumer electronics, military, aerospace, industrial control, artificial intelligence, electric vehicles, and more...

If you have related needs, please click the button below to send us an email.

Capel’s high-density 3-layer multilayer PCB is a core circuit component tailored for various electronic devices requiring strict circuit integration and space utilization. It balances high-performance transmission and flexible adaptability with an exquisite structural design and premium craftsmanship, covering diverse application scenarios. Adopting a 3-layer structure with a precisely controlled board thickness of 0.15mm, it combines thinness and lightweight with structural stability, enabling flexible integration into the internal compact space of various electronic devices. It fits complex wiring layouts without occupying redundant space, meeting the miniaturization and integration design requirements of equipment—especially suitable for precision electronic scenarios sensitive to volume and weight.

Equipped with 2μm immersion gold surface finish, the uniform and thick gold layer offers excellent oxidation resistance and contact stability, effectively reducing contact resistance to ensure smooth and accurate signal transmission, and avoiding signal attenuation caused by long-term use or environmental changes. The 3-layer design enables high-density wiring, supporting parallel transmission of multi-channel signals while minimizing interference, providing stable circuit support for complex circuit systems and adapting to various electronic devices requiring efficient signal interaction.

As a professional PCB solution provider, Capel offers comprehensive customization capabilities: personalized development of 1-30 layer FPC flexible PCBs, 2-32 layer rigid-flex PCBs, and 1-60 layer rigid PCBs, complemented by reliable rapid-turnaround PCB prototyping and fast SMT PCB assembly services to help customers accelerate product R&D cycles and mass production processes. Our services span multiple industries, including medical devices, IoT, TUT, drones, aviation, automotive, telecommunications, consumer electronics, military, aerospace, industrial control, artificial intelligence, electric vehicles, and more. With stable product quality and flexible service models, we have become a trusted partner for customers across various sectors.

If you have related PCB customization needs, please click the button below to send us an email. Capel will provide you with a tailored solution.

Capel Flexible PCB & Rigid-Flex PCB Process Capability

Category	Process Capability	Category	Process Capability
Production Type	Single layer FPC / Double layers FPC Multi-layer FPC / Aluminum PCBs Rigid-Flex PCB	Layers Number	1-30 layers FPC 2-32 layers Rigid-FlexPCB 1-60 layers Rigid PCB HDI Boards
Max Manufacture Size	Single layer FPC 4000mm Double layers FPC 1200mm Multi-layers FPC 750mm Rigid-Flex PCB 750mm	Insulating Layer Thickness	27.5um /37.5/ 50um /65/ 75um / 100um / 125um / 150um
Board Thickness	FPC 0.06mm - 0.4mm Rigid-Flex PCB 0.25 - 6.0mm	Tolerance of PTH Size	±0.075mm
Surface Finish	Immersion Gold/Immersion Silver/Gold Plating/Tin Plating/OSP	Stiffener	FR4 / PI / PET / SUS / PSA/Alu
Semicircle Orifice Size	Min 0.4mm	Min Line Space/ width	0.045mm/0.045mm
Thickness Tolerance	±0.03mm	Impedance	50Ω-120Ω
Copper Foil Thickness	9um/12um / 18um / 35um / 70um/100um	Impedance Controlled Tolerance	±10%
Tolerance of NPTH Size	±0.05mm	The Min Flush Width	0.80mm
Min Via Hole	0.1mm	Implement Standard	GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III

Capel manufactures customized high-precision Rigid Flexible Circuit Board / Flexible PCB / HDI PCB with 15 years of experience with our professionalism

2 Layer Flexible PCB Boards Stackup

4 Layer Rigid-Flex PCB Stackup

8 layer HDI PCBs

Testing And Inspection Equipment

Microscope Testing

AOI Inspection

2D Testing

Impedance Testing

RoHS Testing

Flying Probe

Horizontal Tester

Bending Teste

Capel provide customers customized PCB Service with 15 years of experience

Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.