Multilayer Flex PCB for AR Glasses: Enabling Lightweight, High-Performance Augmented Reality Displays-Pcb Manufacturer, Rigid Flex Pcb, Flexible Pcb

AR Glasses Multi-Layer Flexible PCB

Brief Introduction:

Type: Multi-layer board

Material: Adhesive-free calendering, yellow cover film

Number of Layers: 4 layers

Line Width/Spacing: 0.05mm

Capel Services:

Custom FPC flexible PCBs (1-30 layers), rigid-flex PCBs (2-32 layers), rigid PCBs (1-60 layers), reliable rapid turnaround PCB prototyping, fast SMT PCB assembly

Industries Served:

Medical devices, IoT, TUT, drones, aviation, automotive, telecommunications, consumer electronics, military, aerospace, industrial control, artificial intelligence, electric vehicles, and more...

If you have related needs, please click the button below to send us an email.

Capel’s multi-layer flexible PCB for AR glasses is a high-density integrated circuit core component tailored for augmented reality (AR) near-eye display devices, precisely addressing the design pain points of AR glasses—lightweight, miniaturization, and high performance. Adopting a 4-layer multi-board structure, the product features a premium combination of adhesive-free rolled substrate and yellow coverlay, paired with an ultra-fine line width and spacing of 0.05mm. It achieves efficient integration and low-loss transmission of multi-channel signals in an extremely compact space, perfectly fitting the tight layout of AR glass frames, micro-display modules, attitude sensors, wireless communication modules, and other components.

The adhesive-free rolled substrate offers excellent flexibility and signal conduction performance; the copper foil with a regular crystal structure significantly reduces the transmission loss of high-definition image data, real-time attitude signals, and Bluetooth/Wi-Fi communication signals, avoiding signal delay or distortion that impairs the fluency of AR interaction. The yellow coverlay provides strong insulation, wear resistance, and bending resistance, resisting slight friction, bending, and environmental dust erosion during daily wear, extending the device’s service life while meeting the strict reliability requirements for AR glass components.

As a professional PCB solution provider, Capel offers comprehensive customization services: supporting the personalized development of 1-30 layer FPC flexible PCBs, 2-32 layer rigid-flex PCBs, and 1-60 layer rigid PCBs. We also provide reliable fast-turn PCB prototyping and rapid SMT PCB assembly services to help customers accelerate product R&D and mass production processes. Our services span multiple industries including medical equipment, Internet of Things (IoT), TUT, drones, aviation, automotive, telecommunications, consumer electronics, military, aerospace, industrial control, artificial intelligence (AI), and electric vehicles. With stable quality and flexible customization capabilities, we have become a trusted partner for customers across various sectors.

If you have PCB customization needs for AR glasses or other fields, please click the button below to send us an email. Capel will provide you with a tailored solution.

Capel Flexible PCB & Rigid-Flex PCB Process Capability

Category	Process Capability	Category	Process Capability
Production Type	Single layer FPC / Double layers FPC Multi-layer FPC / Aluminum PCBs Rigid-Flex PCB	Layers Number	1-30 layers FPC 2-32 layers Rigid-FlexPCB 1-60 layers Rigid PCB HDI Boards
Max Manufacture Size	Single layer FPC 4000mm Double layers FPC 1200mm Multi-layers FPC 750mm Rigid-Flex PCB 750mm	Insulating Layer Thickness	27.5um /37.5/ 50um /65/ 75um / 100um / 125um / 150um
Board Thickness	FPC 0.06mm - 0.4mm Rigid-Flex PCB 0.25 - 6.0mm	Tolerance of PTH Size	±0.075mm
Surface Finish	Immersion Gold/Immersion Silver/Gold Plating/Tin Plating/OSP	Stiffener	FR4 / PI / PET / SUS / PSA/Alu
Semicircle Orifice Size	Min 0.4mm	Min Line Space/ width	0.045mm/0.045mm
Thickness Tolerance	±0.03mm	Impedance	50Ω-120Ω
Copper Foil Thickness	9um/12um / 18um / 35um / 70um/100um	Impedance Controlled Tolerance	±10%
Tolerance of NPTH Size	±0.05mm	The Min Flush Width	0.80mm
Min Via Hole	0.1mm	Implement Standard	GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III

Capel manufactures customized high-precision Rigid Flexible Circuit Board / Flexible PCB / HDI PCB with 15 years of experience with our professionalism

2 Layer Flexible PCB Boards Stackup

4 Layer Rigid-Flex PCB Stackup

8 layer HDI PCBs

Testing And Inspection Equipment

Microscope Testing

AOI Inspection

2D Testing

Impedance Testing

RoHS Testing

Flying Probe

Horizontal Tester

Bending Teste

Capel provide customers customized PCB Service with 15 years of experience

Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.