Caboer’s 3-Layer Rigid-Flex Board for Communication Equipment is tailored for base station communication modules, IoT gateways, automotive communication terminals, portable communication devices, and more. It precisely meets the core demands of communication scenarios: stable high-frequency signal transmission, narrow space adaptation, and strong anti-interference capability, serving as the core circuit carrier for modular integration of communication electronic equipment.
Adopting a 3-layer rigid-flex synergy structure: the 0.11mm flexible layer is extremely thin and lightweight with excellent bending toughness, flexibly fitting narrow wiring paths, curved structures, and module connections inside communication equipment to avoid wiring interference and pulling damage. The 1mm rigid layer is structurally stable, reliably supporting core components such as RF chips, signal processors, and high-density connectors, enabling efficient integration of "flexible adaptation to compact layouts + rigid fixation of precision parts". With precise dimensions of 64*14mm, the slender design perfectly fits the narrow-gap installation needs of communication equipment, occupying no redundant space while balancing integration compatibility and mechanical stability.
Key advantages: ① Full-board immersion gold finish, featuring oxidation resistance and low contact resistance, ensuring high-speed and accurate transmission of high-frequency communication signals (e.g., RF, wireless transmission signals) with minimal signal attenuation; ② Solder mask with white characters + through-hole design, clear markings facilitating module assembly, debugging, and post-maintenance, enhancing soldering reliability and operational efficiency; ③ 3-layer wiring with scientific partitioning, rationally planning signal, power, and ground layers to effectively suppress electromagnetic interference (EMI), adapting to multi-module collaboration of communication equipment (signal reception, processing, transmission), and meeting signal integrity requirements in complex communication scenarios.
Caboer provides customization for 1-30 layer FPC, 2-32 layer rigid-flex boards, paired with rapid prototyping and efficient SMT assembly services. Covering telecommunications, IoT, automotive electronics, and other fields, we deliver highly adaptive and reliable solutions for communication equipment R&D.
Caboer Flexible PCB & Rigid-Flex PCB Process Capability
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Category
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Process Capability
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Category
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Process Capability
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Production Type
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Single layer FPC / Double layers FPC Multi-layer FPC / Aluminum PCBs Rigid-Flex PCB
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Layers Number
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1-30 layers FPC 2-32 layers Rigid-FlexPCB 1-60 layers Rigid PCB HDI Boards
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Max Manufacture Size
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Single layer FPC 4000mm Double layers FPC 1200mm Multi-layers FPC 750mm Rigid-Flex PCB 750mm
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Insulating Layer Thickness
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27.5um /37.5/ 50um /65/ 75um / 100um / 125um / 150um
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Board Thickness
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FPC 0.06mm - 0.4mm Rigid-Flex PCB 0.25 - 6.0mm
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Tolerance of PTH Size
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±0.075mm
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Surface Finish
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Immersion Gold/Immersion Silver/Gold Plating/Tin Plating/OSP
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Stiffener
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FR4 / PI / PET / SUS / PSA/Alu
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Semicircle Orifice Size
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Min 0.4mm
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Min Line Space/ width
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0.045mm/0.045mm
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Thickness Tolerance
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±0.03mm
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Impedance
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50Ω-120Ω
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Copper Foil Thickness
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9um/12um / 18um / 35um / 70um/100um
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Impedance Controlled Tolerance
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±10%
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Tolerance of NPTH Size
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±0.05mm
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The Min Flush Width
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0.80mm
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Min Via Hole
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0.1mm
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Implement Standard
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GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III
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Caboer manufactures customized high-precision Rigid Flexible Circuit Board / Flexible PCB / HDI PCB with 15 years of experience with our professionalism
2 Layer Flexible PCB Boards Stackup
4 Layer Rigid-Flex PCB Stackup
Testing And Inspection Equipment
Caboer provide customers customized PCB Service with 15 years of experience
Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.