New Energy Vehicle 4-Layer Rigid-Flex PCB
New Energy Vehicle 4-Layer Rigid-Flex PCB
  • New Energy Vehicle 4-Layer Rigid-Flex PCB
  • New Energy Vehicle 4-Layer Rigid-Flex PCB
  • New Energy Vehicle 4-Layer Rigid-Flex PCB
  • New Energy Vehicle 4-Layer Rigid-Flex PCB
  • New Energy Vehicle 4-Layer Rigid-Flex PCB
  • New Energy Vehicle 4-Layer Rigid-Flex PCB

Brief Introduction:

Type: Multi-layer Rigid-Flex PCB

Surface Finish: Immersion Gold

Number of Layers: 4

Board Thickness: Flexible Layer: 0.13mm, Rigid Layer: 0.8mm

Solder Mask: White characters, through-hole board

Dimensions: 53.5*52.25mm

Caboer Services:

Custom manufacturing of 1-30 layer FPC flexible PCBs, 2-32 layer rigid-flex PCBs, and 1-60 layer rigid PCBs. Reliable rapid turnaround PCB prototyping and fast SMT PCB assembly.

Industries Served:

Medical devices, IoT, TUT, drones, aviation, automotive, telecommunications, consumer electronics, military, aerospace, industrial control, artificial intelligence, electric vehicles, and more...

If you have related needs, please click the button below to send us an email.

Caboer’s 4-Layer Rigid-Flex PCB for New Energy Vehicles (NEVs) is tailored for core components of new energy vehicles, such as Battery Management Systems (BMS), on-board sensor modules, motor control units, and vehicle communication modules. It precisely meets the core demands of automotive scenarios: high reliability, resistance to harsh environments, stable signal transmission, and compact adaptation, serving as a key circuit carrier for modular integration of NEV electronic systems.

Adopting a 4-layer rigid-flex synergy structure: the 0.13mm flexible layer is extremely thin and lightweight with excellent bending toughness, flexibly fitting complex wiring paths, connections between moving parts, and narrow cavities inside vehicles. It avoids wiring damage from pulling and is compatible with installation requirements in multiple NEV areas (e.g., chassis, cockpit). The 0.8mm rigid layer is structurally stable, reliably supporting core components such as power chips, high-density connectors, and sensors, enabling efficient integration of "flexible adaptation to complex structures + rigid fixation of precision parts". With precise dimensions of 53.5*52.25mm, the compact layout saves space, perfectly aligning with the "lightweight, high-density integration" design trend of NEV electronic systems.

Key advantages: ① Full-board immersion gold finish, offering superior temperature resistance (-40℃ to 125℃), oxidation resistance, and vibration/wear resistance. It can withstand extreme temperature changes, vibration impacts, and slight oil contamination in automotive environments. Low contact resistance ensures stable transmission of power signals and data signals, meeting the long-term high-frequency operation requirements of NEVs; ② Solder mask with white characters + through-hole design, clear markings facilitating assembly, debugging, and post-maintenance of on-board modules, enhancing soldering reliability and operational efficiency to adapt to large-scale production in the automotive manufacturing industry; ③ 4-layer wiring with scientific partitioning, rationally planning power, signal, and ground layers to effectively suppress electromagnetic interference (EMI). It adapts to multi-module collaboration (e.g., battery status monitoring, motor control, on-board communication), meeting the strict requirements for signal integrity and functional safety of NEV electronic systems.

Caboer provides customization for 1-30 layer FPC, 2-32 layer rigid-flex PCBs, paired with rapid prototyping and efficient SMT assembly services. Covering new energy vehicles, automotive electronics, industrial control, and other fields, we deliver highly adaptive and safe solutions for the R&D of core electronic components in NEVs.

Caboer Flexible PCB & Rigid-Flex PCB Process  Capability
CategoryProcess CapabilityCategoryProcess Capability
Production TypeSingle layer FPC / Double layers FPC
Multi-layer FPC / Aluminum PCBs
Rigid-Flex PCB
Layers Number1-30 layers FPC
2-32 layers Rigid-FlexPCB
1-60 layers Rigid PCB
HDI Boards
Max Manufacture SizeSingle layer FPC 4000mm
Double layers FPC 1200mm
Multi-layers FPC 750mm
Rigid-Flex PCB 750mm
Insulating Layer
Thickness
27.5um /37.5/ 50um /65/ 75um / 100um /
125um / 150um
Board ThicknessFPC 0.06mm - 0.4mm
Rigid-Flex PCB 0.25 - 6.0mm
Tolerance of PTH
Size
±0.075mm
Surface FinishImmersion Gold/Immersion
Silver/Gold Plating/Tin Plating/OSP
StiffenerFR4 / PI / PET / SUS / PSA/Alu
Semicircle Orifice SizeMin 0.4mmMin Line Space/ width0.045mm/0.045mm
Thickness Tolerance±0.03mmImpedance50Ω-120Ω
Copper Foil Thickness9um/12um / 18um / 35um / 70um/100umImpedance
Controlled
Tolerance
±10%
Tolerance of NPTH
Size
±0.05mmThe Min Flush Width0.80mm
Min Via Hole0.1mmImplement
Standard
GB / IPC-650 / IPC-6012 / IPC-6013II /
IPC-6013III
Caboer manufactures customized high-precision Rigid Flexible Circuit Board / Flexible PCB / HDI PCB with 15 years of experience with our professionalism
2 Layer Flexible PCB Boards Stackup
4 Layer Rigid-Flex PCB Stackup
8 layer HDI PCBs
Testing And Inspection Equipment
Microscope Testing
AOI Inspection
2D Testing
Impedance Testing
RoHS Testing
Flying Probe
Horizontal Tester
Bending Teste
Caboer provide customers customized PCB Service with 15 years of experience
Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.
Related products

Capel manufacturing PCBs since 2009. Professional technology and high-precision Printed Circuit Boards involved in Medical, IOT, UAV, Aviation, Automotive, Aerospace, Industrial Control, Artificial Intelligence, Consumer Electronics etc..

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CONTACT US

    Shenzhen Capel Technology Co., Ltd. +86 13670210335 sales06@kbefpc.com +86 13670210335 +86 13670210335

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