Caboer’s 6-Layer Multilayer Rigid-Flex Board for Communication Equipment is tailor-made for high-end communication products such as 5G base station modules, IoT gateways, vehicle-mounted communication terminals, and satellite communication devices. It precisely meets the core demands of communication scenarios—stable high-frequency signal transmission, high integration adaptation, strong anti-interference capability, and narrow space compatibility. With 6-layer high-density wiring and a rigid-flex synergy structure, it stands as a performance benchmark for communication equipment R&D, empowering brands to seize technological heights in 5G, IoT, and other key tracks!
Adopting a 6-layer rigid-flex synergy structure, it perfectly balances the performance and adaptability of communication equipment: the 0.2mm optimized flexible layer offers excellent bending toughness and fatigue resistance, flexibly fitting narrow wiring channels, curved structures, and modular layouts inside communication devices. It easily avoids wiring interference and is compatible with multiple installation scenarios (base stations, vehicle-mounted, portable terminals); the 1.6mm sturdy rigid layer meets the high-load operation standards of communication equipment, reliably supporting core components such as RF chips, high-speed connectors, and multi-protocol communication modules (5G/Wi-Fi 6/Bluetooth). This achieves efficient integration of "flexible adaptation to complex structures + rigid fixation of precision parts". With precise dimensions of 85*18mm, the slender layout perfectly aligns with the "compact space, high-density integration" design needs of communication equipment, saving valuable space and providing ample room for function expansion.
Key advantages directly address communication scenario pain points, demonstrating robust technical strength: ① Full-board immersion gold finish delivers superior low-loss, oxidation resistance, and wear resistance, with low contact resistance ensuring high-speed, distortion-free transmission of high-frequency signals (up to 6GHz). It reduces signal attenuation and delay, meeting the requirements of high-speed communication such as 5G and IoT; ② Solder mask with white characters + through-hole design features clear markings, facilitating automated module assembly, rapid debugging, and post-maintenance. It adapts to the mass production needs of communication equipment, significantly improving production efficiency and operational convenience; ③ 6-layer scientific wiring layout rationally separates signal, power, and ground layers, building an efficient shielding and anti-interference system. It effectively suppresses electromagnetic interference (EMI) and signal crosstalk, ensuring seamless collaboration across the full process of "signal reception - processing - transmission" even in complex environments with dense multi-device communication, guaranteeing the integrity and real-time performance of communication data.
Backed by Caboer’s profound technical accumulation in communication-grade PCBs and strict quality control system, this 6-layer rigid-flex board can be customized for wiring density, interface types, communication protocol adaptation, and other requirements based on specific communication equipment needs. Paired with rapid prototyping (sample delivery within 7 days) and efficient SMT assembly services, it helps customers shorten R&D cycles and accelerate time-to-market. Whether for high-load operation of 5G base stations, vibration resistance of vehicle-mounted communication, or long-distance stable connectivity of IoT devices, it serves as the "core signal hub" of communication equipment with stable performance—helping brands reduce after-sales risks and enhance product competitiveness and market reputation!
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