Industrial Control Device Lineup FPC
Industrial Control Device Lineup FPC
  • Industrial Control Device Lineup FPC
  • Industrial Control Device Lineup FPC

Industrial Control Device Lineup FPC

A short introduction:

Type: Industrial Control Device Lineup FPC

Minimum Line Width/Line Spacing: 0.13mm/0.12mm

Number of Layers: 1 Layer

Thickness: 0.13mm

Surface Finish: Immersion Gold 1 Micro Inch

Capel's Services:

Support Customized 1-30 Layer FPC Flexible PCB, 2-32 Layer Rigid-Flexible PCB, 1-60 Layer Rigid PCB, Reliable Fast Turnaround PCB prototyping, rapid SMT PCB assembly

Industries we serve:

Medical devices, IoT, TUT, drones, aerospace, automotive, telecom, consumer electronics, military, aerospace, industrial control, AI, electric vehicles, etc. ......

If you have related needs, please feel free to send us an email by clicking the button below.

Type: Industrial control equipment special wiring flexible circuit board (FPC), designed for industrial-grade signal and power transmission, adapted to sensor data acquisition, motor control commands issued, power distribution between modules and other core scenarios. Whether it is a CNC machine tool axis control module connection, automated production line IO interface expansion, or intelligent warehousing equipment sensor array wiring, can be flexible to fit the equipment inside the small gaps (such as chassis partition, module gap) and irregular surfaces, instead of the traditional wiring harness or flat cables, in the reduction of the wiring volume (save 40% space) while reducing the risk of failure due to cable entanglement, friction (50% reduction in failure rate). Reduces the risk of failure due to cable entanglement and friction (50% reduction in failure rate).


Minimum wire width/spacing: industrial-grade accuracy of 0.13mm/0.12mm. This parameter is specially optimized for industrial control signal characteristics: 0.13mm line width ensures that control signals (such as 24V switching output from PLC) and low-power power supply (≤1A) have lower transmission loss (voltage drop ≤0.2V/m), avoiding false alarms due to insufficient power supply to the sensors; 0.12mm line spacing in the limited width of the wiring (e.g., 10mm width can accommodate ≥30 lines) to achieve dense 0.12mm wire spacing to achieve dense wiring within a limited wiring width (e.g. 10mm width can accommodate ≥30 lines), support “signal + power + ground” parallel transmission, and isolate digital signals from analog signals through a reasonable spacing (isolation ≥45dB), to avoid false triggering of signals due to electromagnetic interference when the motor is started (false operation rate ≤0.01 times / 10,000 hours).


Layers: 1-layer structural design, through streamlining the layout to achieve the dual goals of “high reliability + easy maintenance”:

Single-layer wiring reduces the number of inter-layer connection points (e.g., via holes), reducing the risk of circuit breakage due to inter-layer stripping (compared with the multi-layer design of the 60% reduction in the number of points of failure), especially suitable for vibration-frequent industrial scenarios (e.g., punching presses, forging presses);

wiring Visible wire routing facilitates troubleshooting during equipment maintenance (e.g. visual inspection of broken wires, wear and tear) and shortens downtime for maintenance (average maintenance time ≤ 30 minutes).

At the same time, a large area of grounding copper foil and signal lines adjacent to the design, the formation of “signal - ground” shielding structure, to inhibit RF interference in the industrial environment (EMI suppression ≥ 40dB).


Thickness: 0.13mm ultra-thin characteristics, perfectly adapted to the industrial control equipment, “compact space + dynamic adaptation” needs. In modular equipment (such as stacked IO modules), can significantly reduce the occupation of the row of wires on the module spacing (module gap can be reduced to 1mm); in the need to bend parts (such as equipment door axle, movable arm connection), can adapt to the minimum bending radius R = 3mm of repeated deformation (support ≥ 100,000 times ± 90 ° bending), to avoid fatigue breakage of row of wires due to the equipment opening and closing, and at the same time to maintain the line resistance At the same time to maintain line resistance stability (change rate ≤ 1%).


Surface treatment: the use of immersed gold 1 micro-inch process (nickel layer thickness ≥ 3μm, gold layer thickness ≥ 0.025μm), bringing multiple industrial-grade advantages:

excellent conductivity of the gold layer, the contact resistance of ≤ 30mΩ, to ensure the stability of the transmission of low-level signals (such as the sensor output of the 4-20mA current signals), the measurement error is ≤ 0.5%;

immersed gold plating layer of corrosion resistance, can be resistant to industrial workshops, oil and dirt, Coolant, dust erosion (through the 72-hour neutral salt spray test without corrosion), to adapt to the relative humidity of 95% (no condensation) of the humid environment;

to enhance the reliability of connector insertion and extraction, the low coefficient of friction of the gold layer (≤ 0.15) to reduce insertion and extraction of wear and tear, so that the life of the connector to increase to ≥ 500 times the insertion and extraction (the traditional tin-plated layer of about 300 times) to reduce the frequency of maintenance and replacement.


Capel Flexible PCB & Rigid-Flex PCB Process  Capability
Category Process Capability Category Process Capability
Production Type Single layer FPC / Double layers FPC
Multi-layer FPC / Aluminum PCBs
Rigid-Flex PCB
Layers Number 1-30 layers FPC
2-32 layers Rigid-FlexPCB
1-60 layers Rigid PCB
HDI Boards
Max Manufacture Size Single layer FPC 4000mm
Double layers FPC 1200mm
Multi-layers FPC 750mm
Rigid-Flex PCB 750mm
Insulating Layer
Thickness
27.5um /37.5/ 50um /65/ 75um / 100um /
125um / 150um
Board Thickness FPC 0.06mm - 0.4mm
Rigid-Flex PCB 0.25 - 6.0mm
Tolerance of PTH
Size
±0.075mm
Surface Finish Immersion Gold/Immersion
Silver/Gold Plating/Tin Plating/OSP
Stiffener FR4 / PI / PET / SUS / PSA/Alu
Semicircle Orifice Size Min 0.4mm Min Line Space/ width 0.045mm/0.045mm
Thickness Tolerance ±0.03mm Impedance 50Ω-120Ω
Copper Foil Thickness 9um/12um / 18um / 35um / 70um/100um Impedance
Controlled
Tolerance
±10%
Tolerance of NPTH
Size
±0.05mm The Min Flush Width 0.80mm
Min Via Hole 0.1mm Implement
Standard
GB / IPC-650 / IPC-6012 / IPC-6013II /
IPC-6013III
Capel manufactures customized high-precision Rigid Flexible Circuit Board / Flexible PCB / HDI PCB with 15 years of experience with our professionalism
2 Layer Flexible PCB Boards Stackup
4 Layer Rigid-Flex PCB Stackup
8 layer HDI PCBs
Testing And Inspection Equipment
Microscope Testing
AOI Inspection
2D Testing
Impedance Testing
RoHS Testing
Flying Probe
Horizontal Tester
Bending Teste
Capel provide customers customized PCB Service with 15 years of experience
Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.


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Capel manufacturing PCBs since 2009. Professional technology and high-precision Printed Circuit Boards involved in Medical, IOT, UAV, Aviation, Automotive, Aerospace, Industrial Control, Artificial Intelligence, Consumer Electronics etc..

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CONTACT US

    Shenzhen Capel Technology Co., Ltd. +86 13670210335 sales06@kbefpc.com +86 13670210335 +86 13670210335

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