Type: Display wiring special flexible circuit board (FPC), designed for display internal signal transmission, with excellent flexible bending performance. Whether it is a home consumer electronic display, industrial control touch screen, or medical equipment high-definition display, can be flexibly adapted to the complex wiring space within the equipment, to achieve efficient circuit connection between the display and driver board, control board, instead of the traditional rigid wiring, reduce the size of the equipment.

Minimum line width/spacing: 0.055mm/0.09mm high precision standard. This parameter is optimized for the demand of high resolution signal transmission for displays, which can arrange more precision lines in the limited space of the wiring to meet the high speed and low loss transmission of high definition image signals (e.g. 4K, 8K video signals), avoiding signal interference or delay due to line congestion, and guaranteeing the smoothness and clarity of the screen display.

Layers: 3-layer structure design, through a reasonable division of the signal layer, power layer and grounding layer, to realize the layered management of signal transmission. The signal layer focuses on the precise transmission of image data, the power supply layer provides stable power supply for the display module, and the grounding layer effectively shields the external electromagnetic interference. The three-layer synergy significantly reduces the risk of signal crosstalk, which is especially suitable for high-end display scenarios with parallel transmission of multi-channel signals.

Thickness: Only 0.18mm thin and light, providing strong support for the thin and light design of the monitor. In the structure where the internal space of the display is very scarce, it can significantly reduce the space occupied by the wires and help the device realize a more compact appearance design, while reducing the difficulty of installing the wires and improving the production and assembly efficiency.

Surface treatment: Adopting gold immersion process, through the uniform deposition of nickel-gold plating on the surface of copper layer, it brings multiple advantages:

Enhance the corrosion and abrasion resistance of the line to adapt to the long-term use of displays in environmental changes (such as temperature and humidity fluctuations, light dust);

Enhance the conductivity and weldability of soldering joints to ensure that the wires are in stable contact with the welding parts of the display modules and driver boards to reduce the loss of signal transmission;

The surface of the gold layer is smooth and even, reducing the signal transfer process in the process. Smooth surface of gold layer reduces impedance change during signal transmission and guarantees the stability of high-frequency signal transmission.

Capel Flexible PCB & Rigid-Flex PCB Process  Capability

2 Layer Flexible PCB Boards Stackup

4 Layer Rigid-Flex PCB Stackup

8 layer HDI PCBs

Microscope Testing

AOI Inspection

2D Testing

Impedance Testing

RoHS Testing

Flying Probe

Horizontal Tester

Bending Teste

Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.