
 
  
  
  
  
  
  
 Tablet PC Camera FPC
A short introduction:
Type: Tablet PC Camera FPC
Minimum Line Width/Line Spacing: 0.15mm/0.075mm
Number of Layers: 4 Layers
Thickness: 0.12mm
Surface Finish: Immersion Gold 1 micro-inch
Capel's Services:
Support Customized 1-30 Layer FPC Flexible PCB, 2-32 Layer Rigid-Flexible Circuit Boards, 1-60 Layer Rigid PCB, Reliable Rapid turnaround PCB prototyping, rapid SMT PCB assembly
Industries We Serve:
Medical devices, IoT, TUT, drones, aerospace, automotive, telecom, consumer electronics, military, aerospace, industrial control, AI, electric vehicles, etc. ......
If you have related needs, please feel free to send us an email by clicking the button below.
With the trend of tablet PCs becoming thinner and lighter with higher pixel cameras, the camera FPC, as the core component connecting the camera module to the motherboard, has a direct impact on the imaging quality and signal transmission stability, and the camera FPC for tablet PCs introduced by Capel has become the preferred solution for the connection of camera circuits in the consumer electronics field due to its fine structural design and reliable process technology.
Type: Tablet PC Camera Flexible Circuit Boards (FPC), designed for tablet front/rear camera modules, with excellent flexible bending performance. Whether it is the built-in camera of thin and light tablets or the rotating camera that supports multi-angle shooting, it can be flexibly adapted to the compact space layout inside the device, realize the efficient circuit connection between the camera and the motherboard, and ensure the accurate transmission of image signals.
Minimum line width/spacing: 0.15mm/0.075mm for high precision. This parameter is optimized for the HD signal transmission of flat panel cameras, which can arrange dense lines within limited wiring space, meet the parallel transmission of multiple signals for HD images (e.g. 13 million, 20 million pixels) and functions such as autofocus and anti-shake, reduce signal interference, and ensure that the details of the picture are clear and free of distortion.
Layers: 4-layer structure design, through scientific layering to achieve fine signal management:
Signal layer focuses on high-speed transmission of image data and control commands, adapting to the camera's high-bandwidth signal requirements;
Power supply layer provides a stable voltage for the camera module, avoiding imaging noise due to fluctuations in the power supply;
Grounding layer effectively shields the external electromagnetic interference (e.g., signal interference from other components within the flat panel), to protect the purity of signals. The ground layer effectively shields the external electromagnetic interference (such as signal interference from other components inside the tablet), ensuring signal purity.
The four-layer synergy greatly improves the stability of the circuit, especially suitable for high-end flat-panel high-resolution camera scenes.
Thickness: 0.12mm, the ultimate thinness, perfectly suited to the thin and light design requirements of tablet PCs. In the limited internal space structure of the tablet, it can significantly reduce the space occupied by the wires around the camera module, helping the device to realize a slimmer body design, and at the same time, reducing the difficulty of bending the wires during the assembly process and improving production efficiency.
Surface treatment: the use of immersion gold 1 micro-inch process, through the copper layer on the surface of the uniform deposition of accurate thickness of nickel-gold plating, bringing multiple advantages:
excellent conductivity of the gold layer, reducing the loss of signal transmission process, to protect the integrity of the high-definition image signal;
1 micro-inch of the precise thickness of the plating layer balances the corrosion resistance and the cost of adapting to the long-term use of the plate of the daily wear and tear and changes in the environment;
to enhance the weldability and reliability of the soldering joints, to ensure that the camera module and the row of rows of the reliability, to ensure that the camera module with the Enhance solderability and reliability of solder joints to ensure that the connection between the camera module and the cable is not easy to oxidize and prolong the service life of the device.
Capel Flexible PCB & Rigid-Flex PCB Process  Capability
| Category | Process Capability | Category | Process Capability | 
| Production Type | Single layer FPC / Double layers FPC Multi-layer FPC / Aluminum PCBs Rigid-Flex PCB | Layers Number | 1-30 layers FPC 2-32 layers Rigid-FlexPCB 1-60 layers Rigid PCB HDI Boards | 
| Max Manufacture Size | Single layer FPC 4000mm Double layers FPC 1200mm Multi-layers FPC 750mm Rigid-Flex PCB 750mm | Insulating Layer Thickness | 27.5um /37.5/ 50um /65/ 75um / 100um / 125um / 150um | 
| Board Thickness | FPC 0.06mm - 0.4mm Rigid-Flex PCB 0.25 - 6.0mm | Tolerance of PTH Size | ±0.075mm | 
| Surface Finish | Immersion Gold/Immersion Silver/Gold Plating/Tin Plating/OSP | Stiffener | FR4 / PI / PET / SUS / PSA/Alu | 
| Semicircle Orifice Size | Min 0.4mm | Min Line Space/ width | 0.045mm/0.045mm | 
| Thickness Tolerance | ±0.03mm | Impedance | 50Ω-120Ω | 
| Copper Foil Thickness | 9um/12um / 18um / 35um / 70um/100um | Impedance Controlled Tolerance | ±10% | 
| Tolerance of NPTH Size | ±0.05mm | The Min Flush Width | 0.80mm | 
| Min Via Hole | 0.1mm | Implement Standard | GB / IPC-650 / IPC-6012 / IPC-6013II / IPC-6013III | 












Capel manufacturing PCBs since 2009. Professional technology and high-precision Printed Circuit Boards involved in Medical, IOT, UAV, Aviation, Automotive, Aerospace, Industrial Control, Artificial Intelligence, Consumer Electronics etc..