Tablet PC Camera FPC
Tablet PC Camera FPC
  • Tablet PC Camera FPC
  • Tablet PC Camera FPC
  • Tablet PC Camera FPC
  • Tablet PC Camera FPC
  • Tablet PC Camera FPC
  • Tablet PC Camera FPC
  • Tablet PC Camera FPC
  • Tablet PC Camera FPC
  • Tablet PC Camera FPC
  • Tablet PC Camera FPC

Tablet PC Camera FPC

A short introduction:

Type: Tablet PC Camera FPC

Minimum Line Width/Line Spacing: 0.15mm/0.075mm

Number of Layers: 4 Layers

Thickness: 0.12mm

Surface Finish: Immersion Gold 1 micro-inch

Capel's Services:

Support Customized 1-30 Layer FPC Flexible PCB, 2-32 Layer Rigid-Flexible Circuit Boards, 1-60 Layer Rigid PCB, Reliable Rapid turnaround PCB prototyping, rapid SMT PCB assembly

Industries We Serve:

Medical devices, IoT, TUT, drones, aerospace, automotive, telecom, consumer electronics, military, aerospace, industrial control, AI, electric vehicles, etc. ......

If you have related needs, please feel free to send us an email by clicking the button below.

With the trend of tablet PCs becoming thinner and lighter with higher pixel cameras, the camera FPC, as the core component connecting the camera module to the motherboard, has a direct impact on the imaging quality and signal transmission stability, and the camera FPC for tablet PCs introduced by Capel has become the preferred solution for the connection of camera circuits in the consumer electronics field due to its fine structural design and reliable process technology.

Type: Tablet PC Camera Flexible Circuit Boards (FPC), designed for tablet front/rear camera modules, with excellent flexible bending performance. Whether it is the built-in camera of thin and light tablets or the rotating camera that supports multi-angle shooting, it can be flexibly adapted to the compact space layout inside the device, realize the efficient circuit connection between the camera and the motherboard, and ensure the accurate transmission of image signals.


Minimum line width/spacing: 0.15mm/0.075mm for high precision. This parameter is optimized for the HD signal transmission of flat panel cameras, which can arrange dense lines within limited wiring space, meet the parallel transmission of multiple signals for HD images (e.g. 13 million, 20 million pixels) and functions such as autofocus and anti-shake, reduce signal interference, and ensure that the details of the picture are clear and free of distortion.


Layers: 4-layer structure design, through scientific layering to achieve fine signal management:

Signal layer focuses on high-speed transmission of image data and control commands, adapting to the camera's high-bandwidth signal requirements;

Power supply layer provides a stable voltage for the camera module, avoiding imaging noise due to fluctuations in the power supply;

Grounding layer effectively shields the external electromagnetic interference (e.g., signal interference from other components within the flat panel), to protect the purity of signals. The ground layer effectively shields the external electromagnetic interference (such as signal interference from other components inside the tablet), ensuring signal purity.

The four-layer synergy greatly improves the stability of the circuit, especially suitable for high-end flat-panel high-resolution camera scenes.


Thickness: 0.12mm, the ultimate thinness, perfectly suited to the thin and light design requirements of tablet PCs. In the limited internal space structure of the tablet, it can significantly reduce the space occupied by the wires around the camera module, helping the device to realize a slimmer body design, and at the same time, reducing the difficulty of bending the wires during the assembly process and improving production efficiency.


Surface treatment: the use of immersion gold 1 micro-inch process, through the copper layer on the surface of the uniform deposition of accurate thickness of nickel-gold plating, bringing multiple advantages:

excellent conductivity of the gold layer, reducing the loss of signal transmission process, to protect the integrity of the high-definition image signal;

1 micro-inch of the precise thickness of the plating layer balances the corrosion resistance and the cost of adapting to the long-term use of the plate of the daily wear and tear and changes in the environment;

to enhance the weldability and reliability of the soldering joints, to ensure that the camera module and the row of rows of the reliability, to ensure that the camera module with the Enhance solderability and reliability of solder joints to ensure that the connection between the camera module and the cable is not easy to oxidize and prolong the service life of the device.

Capel Flexible PCB & Rigid-Flex PCB Process  Capability

CategoryProcess CapabilityCategoryProcess Capability
Production TypeSingle layer FPC / Double layers FPC
Multi-layer FPC / Aluminum PCBs
Rigid-Flex PCB
Layers Number1-30 layers FPC
2-32 layers Rigid-FlexPCB
1-60 layers Rigid PCB
HDI Boards
Max Manufacture SizeSingle layer FPC 4000mm
Double layers FPC 1200mm
Multi-layers FPC 750mm
Rigid-Flex PCB 750mm
Insulating Layer
Thickness
27.5um /37.5/ 50um /65/ 75um / 100um /
125um / 150um
Board ThicknessFPC 0.06mm - 0.4mm
Rigid-Flex PCB 0.25 - 6.0mm
Tolerance of PTH
Size
±0.075mm
Surface FinishImmersion Gold/Immersion
Silver/Gold Plating/Tin Plating/OSP
StiffenerFR4 / PI / PET / SUS / PSA/Alu
Semicircle Orifice SizeMin 0.4mmMin Line Space/ width0.045mm/0.045mm
Thickness Tolerance±0.03mmImpedance50Ω-120Ω
Copper Foil Thickness9um/12um / 18um / 35um / 70um/100umImpedance
Controlled
Tolerance
±10%
Tolerance of NPTH
Size
±0.05mmThe Min Flush Width0.80mm
Min Via Hole0.1mmImplement
Standard
GB / IPC-650 / IPC-6012 / IPC-6013II /
IPC-6013III
Capel manufactures customized high-precision Rigid Flexible Circuit Board / Flexible PCB / HDI PCB with 15 years of experience with our professionalism
2 Layer Flexible PCB Boards Stackup
4 Layer Rigid-Flex PCB Stackup
8 layer HDI PCBs
Testing And Inspection Equipment
Microscope Testing
AOI Inspection
2D Testing
Impedance Testing
RoHS Testing
Flying Probe
Horizontal Tester
Bending Teste
Capel provide customers customized PCB Service with 15 years of experience
Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.
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Capel manufacturing PCBs since 2009. Professional technology and high-precision Printed Circuit Boards involved in Medical, IOT, UAV, Aviation, Automotive, Aerospace, Industrial Control, Artificial Intelligence, Consumer Electronics etc..

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CONTACT US

    Shenzhen Capel Technology Co., Ltd. +86 13670210335 sales06@kbefpc.com +86 13670210335 +86 13670210335

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