Type: 4-layer flexible circuit board (FPC) for medical device controllers, designed for multi-parameter medical controllers with excellent multi-layer signal isolation and anti-interference performance. Whether it's the multi-physiological parameter acquisition circuit of an intensive care monitor, the multi-joint control link of a surgical robot, or the precise flow regulation module of a smart infusion pump, it can flexibly adapt to the dense module layout inside the device (such as multi-layer sensor arrays and integrated main control boards) to realize the layered transmission of biosignals, control commands, and power supply, and provide stable circuits for the “high-precision detection + fast response control” of the medical device. Provides stable circuit support for “high precision detection + fast response control” of medical devices.

Minimum line width/spacing: 0.07mm/0.06mm high precision standard. This parameter is optimized for the characteristics of multi-channel weak signals in medical equipment: 0.07mm line width ensures lower transmission loss (signal attenuation rate ≤0.15dB/m) of μV-level biological signals (e.g., ECG, EEG signals) and reduces signal distortion; 0.06mm line spacing realizes high-density wiring (single panel supports ≥30 independent signals in parallel transmission) in a limited space to support sensor signals, Support independent layout of sensor signals, control commands and power lines to avoid crosstalk of different types of signals (crosstalk suppression ratio ≥75dB), ensuring the accuracy of multi-parameter synchronized monitoring.

Layers: 4-layer structural design, through scientific layering to achieve precise division of functions, to solve the signal management problems of complex medical equipment:

Top Signal Layer: Transmission of high-precision biosensor signals (e.g., analog signals of blood oxygen and blood pressure), with differential alignment design to optimize impedance matching (target impedance 50Ω±5%), to reduce signal reflections;

Power Supply Layer: Independently carrying equipment power supply lines, with a wide-width alignment design (line width ≥0.3mm), to avoid crosstalk of different types of signals. （Power supply layer: independently carrying equipment power supply lines, using a wide alignment design (line width ≥ 0.3mm), stable output of ±5V, ±12V and other multi-grade voltage, to avoid power supply fluctuations on the weak signal interference;

grounding layer: a large area of copper foil covering the formation of a 360 ° electromagnetic shielding barrier, isolation of electromagnetic radiation from the internal motor of the device, RF module, to ensure the purity of the weak signal transmission (signal-to-noise ratio of ≥ 85dB);

Bottom layer of signals: the transmission of control commands and digital signals (eg. Bottom signal layer: Transmission of control instructions and digital signals (such as display drive signals, actuator control signals), the use of high-speed alignment design, support for command transmission delay ≤ 50μs, to enhance the speed of response to the operation of the equipment.

The four layers work together to achieve complete isolation of “signal - power - ground”, especially suitable for multi-parameter simultaneous monitoring and complex control of high-end medical equipment scenarios.

Thickness: Optimized thickness of 0.3mm balances structural stability and compactness. In integrated medical devices (such as integrated monitors), it can be adapted to the installation space of multi-layer module stacking (spacing between the main board and sensor modules ≤ 5mm); at the same time, it maintains excellent flexibility characteristics (supporting the minimum bending radius R = 1.5mm), and can be adapted to the complex wiring paths inside the device (e.g., zigzagging paths bypassing batteries and heat dissipation modules), to avoid the performance degradation caused by the stresses of bending the wiring.

Surface treatment: the use of immersion gold 2 micro-inch process (nickel layer thickness ≥ 5μm, gold layer thickness ≥ 0.05μm), bringing multiple medical-grade advantages:

gold layer conductivity is stable, the contact resistance ≤ 8mΩ, reducing the transmission of weak biological signals to reduce loss, to ensure that the multi-parameter monitor's detection error of ≤ 0.3%;

2 micro-inch thickened layer of gold with excellent corrosion resistance, 75% of alcohol, iodine vapors, hydrogen peroxide, and other medical disinfectants to resist frequent wiping. The 2-micron thick gold layer has excellent corrosion resistance and can withstand frequent wiping with 75% alcohol, povidone iodine, hydrogen oxide, and other medical disinfectants (no corrosion and plating peeling off after 3,000 disinfectant wipe tests), adapting to the stringent disinfection needs of 3-5 times a day;

The gold layer's biocompatibility complies with the ISO 10993 standard, with no risk of heavy metal precipitation, ensuring the clinical safety of devices in close contact with the human body (e.g., wearable controllers).

Capel Flexible PCB & Rigid-Flex PCB Process  Capability

2 Layer Flexible PCB Boards Stackup

4 Layer Rigid-Flex PCB Stackup

8 layer HDI PCBs

Microscope Testing

AOI Inspection

2D Testing

Impedance Testing

RoHS Testing

Flying Probe

Horizontal Tester

Bending Teste

Owning 3 factories for Flexible PCB&Rigid-Flex PCB, Rigid PCB, DIP/SMT Assembly;
300+Engineers Provide technical support for Pre-sales and after-sales online;
1-30 layers FPC, 2-32 layers Rigid-FlexPCB, 1-60 layers Rigid PCB
HDI Boards, Flexible PCB (FPC), Rigid-Flex PCBs, Multilayer PCBs, Single-sided PCB, Double-Sided Circuit Boards, Hollow Boards, Rogers PCB, rf PCB, Metal Core PCB, Special Process Boards, Ceramic PCB, Aluminum PCB, SMT & PTH Assembly, PCB Prototype Service.
Provide 24-hour PCB Prototyping service,Small Batches of circuit boards will be delivered in 5-7 days, Mass Production of PCB boards will be delivered in 2-3 weeks;
Industries we service: Medical Devices, IOT, TUT, UAV, Aviation, Automotive, Telecommunications, Consumer Electronics, Military, Aerospace, Industrial Control, Artificial Intelligence, EV, etc…
Our Production Capacity:
FPC and Rigid-Flex PCBs production capacity can reach more than 150000sqm per month,
PCB production capacity can reach 80000sqm per month,
PCB Assembling capacity at 150,000,000 components per month.
Our teams of engineers and researchers are dedicated to fulfilling your requirements with precision and professionalism.