Model: FR4 Printed Circuit Boards
Product application: SmartPhone
Board Layers: Multilayer
Base material: Polyimide(PI)
Inner Cu thickness: 18um
Quter Cu thickness: 35um
Cover film color: Yellow
Solder mask color: Yellow
Silkscreen: White
Surface treatment: ENIG
FPC thickness: 0.26 +/-0.03mm
Stiffener type: FR4 ,PI
Min Line width/space: 0.1/0.1mm
Min hole: 0.15mm
Blind hole:/
Buried hole:/
Hole tolerance(nm): PTH: 士 material: 士0.05
lBoard Layers:/